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Overall ICT footprint and green communication technologies

Willem Vereecken UGent, Ward Van Heddeghem UGent, Didier Colle UGent, Mario Pickavet UGent and Piet Demeester UGent (2010) Proceedings of the 4th International symposium on Communications, Control and Signal Processing (ISCCSP 2010).
abstract
Green communication technologies currently receive a lot of attention. In this paper we give an overview of the environmental issues related to communication technologies en present an estimation of the overall ICT footprint. Additionally we present some approaches on how to reduce this footprint and how ICT can assist in other sectors reducing their footprint.
Please use this url to cite or link to this publication:
author
organization
year
type
conference
publication status
published
subject
keyword
environmental factors, green communication technologies, information technology, environmental issues, overall ICT footprint
in
Proceedings of the 4th International symposium on Communications, Control and Signal Processing (ISCCSP 2010)
pages
6 pages
publisher
IEEE
place of publication
Piscataway, NJ, USA
conference name
4th International Symposium on Communications, Control and Signal Processing (ISCCSP 2010)
conference location
Limassol , Cyprus
conference start
2010-03-03
conference end
2010-03-05
Web of Science type
Conference Paper
Web of Science id
11306007
ISBN
9781424462858
9781424462872
DOI
10.1109/ISCCSP.2010.5463327
language
English
UGent publication?
yes
classification
C1
additional info
invited paper
copyright statement
I have transferred the copyright for this publication to the publisher
id
989087
handle
http://hdl.handle.net/1854/LU-989087
date created
2010-06-28 10:46:20
date last changed
2011-04-13 13:48:01
@inproceedings{989087,
  abstract     = {Green communication technologies currently receive a lot of attention. In this paper we give an overview of the environmental issues related to communication technologies en present an estimation of the overall ICT footprint. Additionally we present some approaches on how to reduce this footprint and how ICT can assist in other sectors reducing their footprint.},
  author       = {Vereecken, Willem and Van Heddeghem, Ward and Colle, Didier and Pickavet, Mario and Demeester, Piet},
  booktitle    = {Proceedings of the 4th International symposium on Communications, Control and Signal Processing (ISCCSP 2010)},
  isbn         = {9781424462858},
  keyword      = {environmental factors,green communication technologies,information technology,environmental issues,overall ICT footprint},
  language     = {eng},
  location     = {Limassol , Cyprus},
  pages        = {6},
  publisher    = {IEEE},
  title        = {Overall ICT footprint and green communication technologies},
  url          = {http://dx.doi.org/10.1109/ISCCSP.2010.5463327},
  year         = {2010},
}

Chicago
Vereecken, Willem, Ward Van Heddeghem, Didier Colle, Mario Pickavet, and Piet Demeester. 2010. “Overall ICT Footprint and Green Communication Technologies.” In Proceedings of the 4th International Symposium on Communications, Control and Signal Processing (ISCCSP 2010). Piscataway, NJ, USA: IEEE.
APA
Vereecken, W., Van Heddeghem, W., Colle, D., Pickavet, M., & Demeester, P. (2010). Overall ICT footprint and green communication technologies. Proceedings of the 4th International symposium on Communications, Control and Signal Processing (ISCCSP 2010). Presented at the 4th International Symposium on Communications, Control and Signal Processing (ISCCSP 2010), Piscataway, NJ, USA: IEEE.
Vancouver
1.
Vereecken W, Van Heddeghem W, Colle D, Pickavet M, Demeester P. Overall ICT footprint and green communication technologies. Proceedings of the 4th International symposium on Communications, Control and Signal Processing (ISCCSP 2010). Piscataway, NJ, USA: IEEE; 2010.
MLA
Vereecken, Willem, Ward Van Heddeghem, Didier Colle, et al. “Overall ICT Footprint and Green Communication Technologies.” Proceedings of the 4th International Symposium on Communications, Control and Signal Processing (ISCCSP 2010). Piscataway, NJ, USA: IEEE, 2010. Print.