Ghent University Academic Bibliography

Show Sort by

Your filters: cql: parent exact "IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY"

Add to list
Fabrication and characterization of flexible ultrathin chip package using photosensitive polyimide

Liang Wang (UGent) , Tom Sterken (UGent) , Maarten Cauwe (UGent) , Dieter Cuypers (UGent) and Jan Vanfleteren (UGent)

(2012) IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY. 2(7). p.1099-1106
Add to list
- Journal Article
- A1
- open access
Modeling and optimal design of shorting vias to suppress radiated emission in high-speed alternating PCB planes

Kai-Bin Wu, Ruey-Beei Wu and Daniël De Zutter (UGent)

(2011) IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY. 1(4). p.566-573
Add to list
- Journal Article
- A1
- open access
Developing an advanced module for back-contact solar cells

Jonathan Govaerts (UGent) , J Robbelein, M Gonzalez, I Gordon, K Baert, I De Wolf, Frederick Bossuyt (UGent) , Steven Van Put (UGent) and Jan Vanfleteren (UGent)

(2011) IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY. 1(9). p.1319-1327
Add to list
- Journal Article
- A1
- open access
Eigenmode-based capacitance calculations with applications in passivation layer design

Thomas Demeester (UGent) and Daniël De Zutter (UGent)

(2011) IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY. 1(6). p.912-919
Add to list
- Journal Article
- A1
- open access
Physics-based passivity-preserving parameterized model order reduction for PEEC circuit analysis

Francesco Ferranti (UGent) , Giulio Antonini, Tom Dhaene (UGent) , Luc Knockaert (UGent) and Albert E Ruehli

(2011) IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY. 1(3). p.399-409

← Previous

Academic Bibliography

Fabrication and characterization of flexible ultrathin chip package using photosensitive polyimide

Modeling and optimal design of shorting vias to suppress radiated emission in high-speed alternating PCB planes

Developing an advanced module for back-contact solar cells

Eigenmode-based capacitance calculations with applications in passivation layer design

Physics-based passivity-preserving parameterized model order reduction for PEEC circuit analysis

Contents

Support

Contact