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- Conference Paper
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- open access
Active and passive component embedding into low-cost plastic substrates aimed at smart system applications
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Integration techniques and applications of thin chips on low cost foil substrates
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Stretchable circuits with horseshoe shaped conductors: embedded in elastic polymers
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High curvature bending characterization of ultra-thin chips and chip-on-foil assemblies
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Reliable filling of through vias with silver based conductive adhesives in flexible PEN substrates using low-cost optimized stencil printing methods
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- Conference Paper
- P1
- open access
Bonding bare die LEDs on PET foils for lighting applications: thermal design modeling and bonding experiments
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- Conference Paper
- P1
- open access
Novel methodology to integrate ultra-thin chips on flexible foils
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- Conference Paper
- P1
- open access
A chip embedding solution based on low-cost plastic materials as enabling technology for smart labels
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- Conference Paper
- C1
- open access
Flipchip bonding of thin Si dies onto PET foils: possibilities and applications
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System-in-foil technology