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XPS-study of Cu/epoxy Interfaces after different Wet Chemical Treatments
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Qualitative electroless Ni/Au plating considerations for the solder mask on top of sequential build-up layers
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Epoxy polymer surface modification through wet-chemical organic surface synthesis for adhesion improvement in microelectronics
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Optimization of microvia-technology using excimer laser for build-up layer application in microelectronics
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Interface evolution of epoxy layers due to wetchemical treatments and its relevance to adhesion of electrochemically deposited copper
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The Development of Epoxy Polymer Surface Roughness Due to Wet Chemical Treatments and its Relevance to Adhesion of Electrochemically Deposited Copper
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Processing quality results for electroless/electroplating of high-aspect ratio plated through holes in industrially produced printed circuit boards
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Chemical modification of buildup epoxy surfaces for altering the adhesion of electrochemically deposited copper
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Adhesion strength of the epoxy polymer/copper interface for use in microelectronics
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Dip coating of dielectric and solder mask epoxy polymer layers for build-up purposes