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- Journal Article
- A1
- open access
Ultra-thin DVS-BCB adhesive bonding of III-V wafers, dies and multiple dies to a patterned silicon-on-insulator substrate
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- PhD Thesis
- open access
Hybrid III-V/Si DFB lasers based on polymer bonding technology
(2013) -
Heterogeneous III-V/silicon photonic integrated circuits
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- Conference Paper
- C1
- open access
DVS-BCB adhesive bonding for silicon photonics
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In search for the ideal hybrid silicon laser
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- Conference Paper
- C3
- open access
III-V-on-silicon membrane photonics for near-infrared and mid-infrared apllications
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- Conference Paper
- C3
- open access
Multiple die-to-wafer adhesive bonding for heterogeneous integration
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- Journal Article
- A1
- open access
Hybrid III-V/Si distributed-feedback laser based on adhesive bonding
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- Conference Paper
- P1
- open access
Hybrid silicon lasers for optical interconnect
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- Journal Article
- A1
- open access
1310-nm Hybrid III-V/Si Fabry-Pérot laser based on adhesive bonding
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- Journal Article
- A1
- open access
Die-to-die adhesive bonding procedure for evanescently-coupled photonic devices
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- Conference Paper
- C1
- open access
A silicon photonics platform with heterogeneous III-V integration
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1310 nm Evanescent hybrid III-V/Si laser based on DVS-BCB bonding
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- Conference Paper
- P1
- open access
Laser sources on a heterogeneous III-V/silicon platform
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- Conference Paper
- P1
- open access
Hybrid silicon lasers
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- Conference Paper
- P1
- open access
Die-to-die adhesive bonding for evanescently-coupled photonic devices
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- Conference Paper
- C1
- open access
Evanescently-coupled hybrid III-V/silicon laser based on DVS-BCB bonding
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- Conference Paper
- C1
- open access
III-V/silicon photonic integrated circuits for FTTH and on-chip optical interconnects
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- Conference Paper
- C1
- open access
DVS-BCB bonded, hybrid III-V/Si laser
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- Conference Paper
- C3
- open access
Hybrid III-V/Silicon laser based on DVS-BCB die-to-wafer bonding