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Comparative study of carrier lifetime dependence on dopant concentration in silicon and germanium
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Single crystal CaS: Eu and SrS: Eu luminescent particles obtained by solvothermal synthesis
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- Journal Article
- A1
- open access
Adhesive bonding of InP/InGaAsP dies to processed silicon-on-insulator wafers using DVS-bis-benzocyclobutene
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Adhesion strength of the epoxy polymer/copper interface for use in microelectronics
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The formation of Eu2+ clusters in saturated red Ca0.5Sr0.5S: Eu electroluminescent devices
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Chemical modification of buildup epoxy surfaces for altering the adhesion of electrochemically deposited copper
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Impact of direct plasma hydrogenation on thermal donor formation in n-type CZ silicon
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Kinetic study of wet chemical treatments on the surface roughness of epoxy polymer layers for buildup layers - I. Sweller influence
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Kinetic study of wet chemical treatments on the surface roughness of epoxy polymer layers for buildup layers - II. Oxidative treatment of the surface
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Epoxy polymer surface roughness modeling based on kinetic studies of wet chemical treatments