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Tuning the switching behavior of conductive-bridge resistive memory by the modulation of the cation-supplier alloys
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Special issue: Materials for advanced metallization 2016 (MAM 2016) : preface
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UV cure of oxycarbosilane low-k films
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Stuffing-enabled surface confinement of silanes used as sealing agents on CF4 plasma-exposed 2.0 p-OSG films
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Formation, processing and characterization of Co–Sn intermetallic compounds for potential integration in 3D interconnects
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Electrochemical fabrication of platinum interconnects for implantable electronic devices
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Defect assessment and leakage control in Ge junctions
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Scanning probe microscopy as a scalpel to probe filament formation in conductive bridging memory devices
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Phase formation in intermixed Ni-Ge thin films: influence of Ge content and low-temperature nucleation of hexagonal nickel germanides
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Study of Schottky barrier height modulation for NiSi/Si contact with an antimony interlayer