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Influence of chemical pretreatment of epoxy polymers on the adhesion strength of electrochemically deposited Cu for use in electronic interconnections
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Kinetic study of wet chemical treatments on the surface roughness of epoxy polymer layers for buildup layers - I. Sweller influence
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Kinetic study of wet chemical treatments on the surface roughness of epoxy polymer layers for buildup layers - II. Oxidative treatment of the surface
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Epoxy polymer surface roughness modeling based on kinetic studies of wet chemical treatments
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Subbandgap photoluminescence and electroluminescence at n-GaN electrodes in aqueous solutions
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Deep levels in oxygenated n-type high-resistivity FZ silicon before and after a low-temperature hydrogenation step
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A photoelectrochemical study of InxGa1-xN films
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Tin doping of silicon for controlling oxygen precipitation and radiation hardness.
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Quantitative analysis of trace metals in silicon nitride films by a vapor phase decomposition/solution collection approach
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Electrochemistry and photoetching of n-GaN