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- 2016
- The Effect of the Substrate Characteristics on the Electrochemical Nucleation and Growth of Copper
- 2015
- Hydrogenated dimer acid as a corrosion inhibitor for lead metal substrates in acetic acid
- 2014
- Electrochemical and surface study of neutralized dodecanoic acid on a lead substrate
- 2013
- Electrochemical determination of the cupric ion activity in aqeuous acidic cupric sulfate electrolytes
- Ultra-low copper baths for sub-35 nm copper interconnects
- Electrodeposition of Platinum Thin Films as Interconnects Material for Implantable Medical Applications
- 2011
- The inhibition of enhanced Cu oxidation on ruthenium/diffusion barrier layers for Cu interconnects by carbon alloying into Ru
- Selecting conversion phosphors for white light-emitting diodes
- 2010
- Texture of cobalt germanides on Ge(100) and Ge(111) and its influence on the formation temperature
- Conformality of Al2O3 and AlN deposited by plasma-enhanced atomic layer deposition