Academic Bibliography

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Comparison of Electrochemical and Thermal Evaluation of Hydrogen Uptake in Steel Alloys Having Different Microstructures

Berk Ozdirik (UGent) , Tom Depover (UGent) , Lorenzo Vecchi, Kim Verbeken (UGent) , Herman Terryn and Iris De Graeve (UGent)

(2018) Journal of The Electrochemical Society. 165(11). p.C787-C793
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Electrodeposition of adherent submicron to micron thick manganese dioxide films with optimized current collector interface for 3D Li-ion electrodes

Marina Y Timmermans, Nouha Labyedh, Felix Mattelaer (UGent) , Stanislaw P Zankowski, Stella Deheryan, Christophe Detavernier (UGent) and Philippe M Vereecken

(2017) JOURNAL OF THE ELECTROCHEMICAL SOCIETY. 164(14). p.D954-D963
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The effect of the substrate characteristics on the electrochemical nucleation and growth of copper

Magi Nagar, Aleksandar Radisic, Katrien Strubbe (UGent) and Philippe M Vereecken

(2016) JOURNAL OF THE ELECTROCHEMICAL SOCIETY. 163(12). p.D3053-D3061
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Hydrogenated dimer acid as a corrosion inhibitor for lead metal substrates in acetic acid

Michel De Keersmaecker (UGent) , Otto van den Berg (UGent) , Kim Verbeken (UGent) , Diederik Depla (UGent) and Mieke Adriaens (UGent)

(2015) JOURNAL OF THE ELECTROCHEMICAL SOCIETY. 162(4). p.C167-C179
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Electrochemical and surface study of neutralized dodecanoic acid on a lead substrate

Michel De Keersmaecker (UGent) , Diederik Depla (UGent) , Kim Verbeken (UGent) and Mieke Adriaens (UGent)

(2014) JOURNAL OF THE ELECTROCHEMICAL SOCIETY. 161(3). p.C126-C137
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Electrochemical determination of the cupric ion activity in aqeuous acidic cupric sulfate electrolytes

Tanya Atanasova (UGent) , Katrien Strubbe (UGent) and Philippe M Vereecken

(2013) JOURNAL OF THE ELECTROCHEMICAL SOCIETY. 160(2). p.D60-D65
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Ultra-low copper baths for sub-35 nm copper interconnects

Tanya Atanasova (UGent) , L Carbonell, R Caluwaerts, Zs Tõkei, Katrien Strubbe (UGent) and PM Vereecken

(2013) JOURNAL OF THE ELECTROCHEMICAL SOCIETY. 160(12). p.3255-3259
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Electrodeposition of Platinum Thin Films as Interconnects Material for Implantable Medical Applications

B. M. Morcos, J. M. O'Callaghan, M. F. Amira, C. Van Hoof and Maaike Op de Beeck (UGent)

(2013) JOURNAL OF THE ELECTROCHEMICAL SOCIETY. 160(8). p.D300-D306
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The inhibition of enhanced Cu oxidation on ruthenium/diffusion barrier layers for Cu interconnects by carbon alloying into Ru

Shao-Feng Ding, Qi Xie (UGent) , Steve Müeller, Thomas Waechtler, Hai-Sheng Lu, Stefan E Schulz, Christophe Detavernier (UGent) , Xin-Ping Qu and Thomas Gessner

(2011) JOURNAL OF THE ELECTROCHEMICAL SOCIETY. 158(12). p.H1228-H1232
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Selecting conversion phosphors for white light-emitting diodes

Philippe Smet (UGent) , Anthony Parmentier (UGent) and Dirk Poelman (UGent)

(2011) JOURNAL OF THE ELECTROCHEMICAL SOCIETY. 158(6). p.R37-R54

Academic Bibliography

Comparison of Electrochemical and Thermal Evaluation of Hydrogen Uptake in Steel Alloys Having Different Microstructures

Electrodeposition of adherent submicron to micron thick manganese dioxide films with optimized current collector interface for 3D Li-ion electrodes

The effect of the substrate characteristics on the electrochemical nucleation and growth of copper

Hydrogenated dimer acid as a corrosion inhibitor for lead metal substrates in acetic acid

Electrochemical and surface study of neutralized dodecanoic acid on a lead substrate

Electrochemical determination of the cupric ion activity in aqeuous acidic cupric sulfate electrolytes

Ultra-low copper baths for sub-35 nm copper interconnects

Electrodeposition of Platinum Thin Films as Interconnects Material for Implantable Medical Applications

The inhibition of enhanced Cu oxidation on ruthenium/diffusion barrier layers for Cu interconnects by carbon alloying into Ru

Selecting conversion phosphors for white light-emitting diodes

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