Show 10 5 10 15 20 50 100 250 Sort by year (new to old) Actions Download search results Subscribe to news feed Your filters: cql: parent exact "JOURNAL OF ELECTRONIC PACKAGING" Add to list Journal Article A1 Chimney effect on natural convection cooling of a transistor mounted on a cooling fin Gilbert De Mey (UGent) , M Wojcik, J Pilarski, M Lasota, J Banaszczyk, Bjorn Vermeersch (UGent) , A Napieralski and Michel De Paepe (UGent) (2009) JOURNAL OF ELECTRONIC PACKAGING. 131(1). Add to list Journal Article A1 Comparison between the standard and staggered layout for cooling fins in forced convection cooling O LEON, Gilbert De Mey (UGent) , Erik Dick (UGent) and Jan Vierendeels (UGent) (2003) JOURNAL OF ELECTRONIC PACKAGING. 125(3). p.442-446