Ghent University Academic Bibliography

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Noncontact integration of photonic IC and electronic IC via inductively coupled interconnects

Tongchuan Ma, Liyiming Yang, Yanlu Li (UGent) and Yuan Du

(2025) IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY. 15(1). p.232-234
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Spectral bayesian optimization using a physics-informed rational Szego kernel for microwave design

Yens Lindemans (UGent) , Thijs Ullrick (UGent) , Ivo Couckuyt (UGent) , Tim Pattyn (UGent) , Dirk Deschrijver (UGent) , Dries Vande Ginste (UGent) and Tom Dhaene (UGent)

(2025) IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY. 15(9). p.1836-1846
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Modeling of tunable electronic waveguide devices in graphene using conservative higher order time stepping

Emile Vanderstraeten (UGent) and Dries Vande Ginste (UGent)

(2025) IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY. 15(1). p.30-38
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Compact self-shielding components for beamforming networks implemented in substrate integrated coaxial line technology

Laura Van Messem, Arno Moerman (UGent) , Olivier Caytan (UGent) , Hendrik Rogier (UGent) and Sam Lemey (UGent)

(2025) IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY. 15(1). p.15-21
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Efficient characterization of interconnects with arbitrary polygonal cross sections using fokas-derived Dirichlet-to-Neumann operators

Dries Bosman, Martijn Huynen (UGent) , Daniël De Zutter (UGent) , Xiao Sun, Nicolas Pantano, Geert van der Plas, Eric Beyne and Dries Vande Ginste (UGent)

(2023) IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY. 13(10). p.1567-1575
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Fabrication of a shear stress sensor matrix using standard printed circuit board and overmolding technologies

Ann Monté (UGent) , Jef Daems and Jeroen Missinne (UGent)

(2020) IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY. 10(3). p.479-486
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Machine-learning-based error detection and design optimization in signal integrity applications

Roberto Medico, Domenico Spina (UGent) , Dries Vande Ginste (UGent) , Dirk Deschrijver (UGent) and Tom Dhaene (UGent)

(2019) IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY. 9(9). p.1712-1720
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Stretchable mould interconnect optimization : peeling automation and carrierless techniques

Bart Plovie (UGent) , Yang Yang, Sheila Dunphy (UGent) , Kristof Dhaenens (UGent) , Steven Van Put (UGent) , Frederick Bossuyt (UGent) and Jan Vanfleteren (UGent)

(2019) IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY. 9(5). p.955-962
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A generative modeling framework for statistical link analysis based on sparse data

Simon De Ridder, Paolo Manfredi (UGent) , Jan De Geest, Dirk Deschrijver (UGent) , Daniël De Zutter (UGent) , Tom Dhaene (UGent) and Dries Vande Ginste (UGent)

(2018) IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY. 8(1). p.21-31
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Arbitrarily shaped rigid and smart objects using stretchable interconnections

Imen Chtioui, Frederick Bossuyt (UGent) , Margreet de Kok, Jan Vanfleteren (UGent) and Mohamed Hedi Bedoui

(2016) IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY. 6(4). p.533-544

Academic Bibliography

Noncontact integration of photonic IC and electronic IC via inductively coupled interconnects

Spectral bayesian optimization using a physics-informed rational Szego kernel for microwave design

Modeling of tunable electronic waveguide devices in graphene using conservative higher order time stepping

Compact self-shielding components for beamforming networks implemented in substrate integrated coaxial line technology

Efficient characterization of interconnects with arbitrary polygonal cross sections using fokas-derived Dirichlet-to-Neumann operators

Fabrication of a shear stress sensor matrix using standard printed circuit board and overmolding technologies

Machine-learning-based error detection and design optimization in signal integrity applications

Stretchable mould interconnect optimization : peeling automation and carrierless techniques

A generative modeling framework for statistical link analysis based on sparse data

Arbitrarily shaped rigid and smart objects using stretchable interconnections

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