Ghent University Academic Bibliography

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Wideband complex vector fitting for modeling time delay variations in passive photonic filters

Thijs Ullrick (UGent) , Dirk Deschrijver (UGent) , Wim Bogaerts (UGent) and Tom Dhaene (UGent)

(2023) 2023 IEEE 32nd Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS). In IEEE Conference on Electrical Performance of Electronic Packaging and Systems-EPEPS
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Substrate integrated coaxial line millimeterwave components manufactured in standard PCB

Laura Van Messem, Arno Moerman (UGent) , Olivier Caytan (UGent) , Hendrik Rogier (UGent) and Sam Lemey (UGent)

(2023) 2023 IEEE 32nd Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS). In IEEE Conference on Electrical Performance of Electronic Packaging and Systems-EPEPS
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Analysis of electrostatically induced interconnect structures in single-layer graphene via a conservative first-principles modeling technique

Emile Vanderstraeten (UGent) and Dries Vande Ginste (UGent)

(2023) 2023 IEEE 32ND CONFERENCE ON ELECTRICAL PERFORMANCE OF ELECTRONIC PACKAGING AND SYSTEMS, EPEPS. In IEEE Conference on Electrical Performance of Electronic Packaging and Systems-EPEPS
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Interconnect modeling using a surface admittance operator derived with the Fokas method

Dries Bosman, Martijn Huynen (UGent) , Daniël De Zutter (UGent) , Xiao Sun, Nicolas Pantano, Geert Van der Plas, Eric Beyne and Dries Vande Ginste (UGent)

(2022) 2022 IEEE 31ST CONFERENCE ON ELECTRICAL PERFORMANCE OF ELECTRONIC PACKAGING AND SYSTEMS (EPEPS 2022). In IEEE Conference on Electrical Performance of Electronic Packaging and Systems-EPEPS
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Analysis of the influence of roughness on the propagation constant of a waveguide via two sparse stochastic methods

Ruben Waeytens, Dries Bosman, Martijn Huynen (UGent) , Michiel Gossye, Hendrik Rogier (UGent) and Dries Vande Ginste (UGent)

(2020) 2020 IEEE 29th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS). In IEEE Conference on Electrical Performance of Electronic Packaging and Systems-EPEPS
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Broadband full-wave BIE impedance characterization of 3-D interconnects

Martijn Huynen (UGent) , Daniël De Zutter (UGent) and Dries Vande Ginste (UGent)

(2018) 2018 IEEE 27TH CONFERENCE ON ELECTRICAL PERFORMANCE OF ELECTRONIC PACKAGING AND SYSTEMS (EPEPS). In IEEE Conference on Electrical Performance of Electronic Packaging and Systems-EPEPS p.241-243
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Autoencoding density-based anomaly detection for signal integrity applications

Roberto Medico, Domenico Spina (UGent) , Dries Vande Ginste (UGent) , Dirk Deschrijver (UGent) and Tom Dhaene (UGent)

(2018) 2018 IEEE 27TH CONFERENCE ON ELECTRICAL PERFORMANCE OF ELECTRONIC PACKAGING AND SYSTEMS (EPEPS). In IEEE Conference on Electrical Performance of Electronic Packaging and Systems-EPEPS p.47-49
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A novel methodology to create generative statistical models of interconnects

Simon De Ridder, Paolo Manfredi (UGent) , Jan De Geest, Tom Dhaene (UGent) , Daniël De Zutter (UGent) and Dries Vande Ginste (UGent)

(2016) 2016 IEEE ELECTRICAL DESIGN OF ADVANCED PACKAGING AND SYSTEMS (EDAPS) SYMPOSIUM. In IEEE Conference on Electrical Performance of Electronic Packaging and Systems-EPEPS p.69-71
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Macromodeling of general linear systems under stochastic variations

Yinghao Ye, Domenico Spina (UGent) , Tom Dhaene (UGent) , Luc Knockaert (UGent) and Giulio Antonini

(2016) 2016 IEEE ELECTRICAL DESIGN OF ADVANCED PACKAGING AND SYSTEMS (EDAPS) SYMPOSIUM. In IEEE Conference on Electrical Performance of Electronic Packaging and Systems-EPEPS p.61-63
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The relationship between Galerkin and collocation methods in statistical transmission line analysis

Paolo Manfredi (UGent) , Daniël De Zutter (UGent) and Dries Vande Ginste (UGent)

(2016) 2016 IEEE 25TH CONFERENCE ON ELECTRICAL PERFORMANCE OF ELECTRONIC PACKAGING AND SYSTEMS (EPEPS). In IEEE Conference on Electrical Performance of Electronic Packaging and Systems-EPEPS p.35-37

Academic Bibliography

Wideband complex vector fitting for modeling time delay variations in passive photonic filters

Substrate integrated coaxial line millimeterwave components manufactured in standard PCB

Analysis of electrostatically induced interconnect structures in single-layer graphene via a conservative first-principles modeling technique

Interconnect modeling using a surface admittance operator derived with the Fokas method

Analysis of the influence of roughness on the propagation constant of a waveguide via two sparse stochastic methods

Broadband full-wave BIE impedance characterization of 3-D interconnects

Autoencoding density-based anomaly detection for signal integrity applications

A novel methodology to create generative statistical models of interconnects

Macromodeling of general linear systems under stochastic variations

The relationship between Galerkin and collocation methods in statistical transmission line analysis

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