Show 10 5 10 15 20 50 100 250 Sort by year (new to old) Actions Download search results Subscribe to news feed Your filters: cql: parent exact "European Microelectronics Packaging Conference" Add to list Conference Paper P1 open access Effect of overmolding process on the integrity of electronic circuits Mona Bakr, Yibo Su, Frederick Bossuyt (UGent) and Jan Vanfleteren (UGent) (2019) 2019 22nd European Microelectronics and Packaging Conference & Exhibition (EMPC). In European Microelectronics Packaging Conference