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Lossless high-speed silicon photonic MZI switch with a micro-transfer-printed III-V amplifier
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Adaptive patterning of optical and electrical fan-out for photonic chip packaging
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Integration of ball lens in through-package via to enable photonic chip-to-board coupling
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Active optical links embedded in flexible substrates
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Demonstration of an MT-compatible connectorisation of a laser-ablated optical interconnection on a printed circuit board