Show 10 5 10 15 20 50 100 250 Sort by year (new to old) Actions Download search results Subscribe to news feed Your filters: cql: parent exact "ADVANCES IN ELECTRONIC PACKAGING 2003, VOL 1" Add to list Conference Paper P1 Integrated optics in a standard MCM-D motherboard technology demonstrated in O/E measurement probes Herbert De Pauw (UGent) , Johan De Baets (UGent) , Jan Vanfleteren (UGent) and André Van Calster (UGent) (2003) ADVANCES IN ELECTRONIC PACKAGING 2003, VOL 1. p.169-176