Show 10 5 10 15 20 50 100 250 Sort by year (new to old) Actions Download search results Subscribe to news feed Your filters: cql: parent exact "5th Electronic Materials, Processes and Packaging for Space, Proceedings" Add to list Conference Paper C1 open access Reduced 2nd level solder joint life time of low-CTE mold compound packages Bart Vandevelde, Riet Labie, Geert Willems, Lieven Degrendele (UGent) , Maarten Cauwe (UGent) and Johan De Baets (UGent) (2014) 5th Electronic Materials, Processes and Packaging for Space, Proceedings. Add to list Conference Paper C1 open access Flexible and stretchable circuit technologies for space applications Maarten Cauwe (UGent) , Frederick Bossuyt (UGent) , Johan De Baets (UGent) and Jan Vanfleteren (UGent) (2014) 5th Electronic Materials, Processes and Packaging for Space, Proceedings.