Show 10 5 10 15 20 50 100 250 Sort by year (new to old) Actions Download search results Subscribe to news feed Your filters: cql: parent exact "2016 11th International Microsystems, Packaging, Assembly and Circuits Technology C... Add to list Conference Paper C1 open access One-time deformable thermoplastic devices based on flexible circuit board technology Bart Plovie (UGent) , Yang Yang (UGent) , Joren Guillaume, Sheila Dunphy (UGent) , Kristof Dhaenens (UGent) , Steven Van Put (UGent) , Thomas Vervust (UGent) , Frederick Bossuyt (UGent) and Jan Vanfleteren (UGent) (2016) 2016 11th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT).