Ghent University Academic Bibliography

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- Journal Article
- A1
- open access
Review on the integration of microelectronics for e-textile

Abdella Simegnaw Ahmmed, Benny Malengier (UGent) , Gideon Rotich, Melkie Getnet Tadesse and Lieva Van Langenhove (UGent)

(2021) MATERIALS. 14(17).
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Surface modification of an epoxy resin with polyamines and polydopamine: adhesion towards electroless deposited copper

David Schaubroeck (UGent) , Lothar Mader (UGent) , Peter Dubruel (UGent) and Jan Vanfleteren (UGent)

(2015) APPLIED SURFACE SCIENCE. 353. p.238-244
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Stuffing-enabled surface confinement of silanes used as sealing agents on CF4 plasma-exposed 2.0 p-OSG films

Yiting Sun, Elisabeth Levrau, Liping Zhang, Jef Geypen, Johan Meersschaut, Alexis Franquet, Quoc Le Le, Jean-François de Marneffe, Hugo Bender, Herbert Struyf, et al.

(2015) MICROELECTRONIC ENGINEERING. 137. p.70-74
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Atomic layer deposition of TiO₂ on surface modified nanoporous low-k films

Elisabeth Levrau, Kilian Devloo-Casier (UGent) , Jolien Dendooven (UGent) , Karl F Ludwig, Patrick Verdonck, Johan Meersschaut, Mikhail R Baklanov and Christophe Detavernier (UGent)

(2013) LANGMUIR. 29(39). p.12284-12289
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- Journal Article
- A1
- open access
Synthetic biology and microdevices : a powerful combination

Lyn Venken, Kathleen Marchal (UGent) and Jos Vanderleyden

(2013) ACM JOURNAL ON EMERGING TECHNOLOGIES IN COMPUTING SYSTEMS. 9(4).
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A fixed-angle dynamic heat spreading model for (an)isotropic rear-cooled substrates

Bjorn Vermeersch (UGent) and Gilbert De Mey (UGent)

(2008) JOURNAL OF HEAT TRANSFER-TRANSACTIONS OF THE ASME. 130(12). p.121301-1-121301-9
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- Conference Paper
- C1
- open access
Dynamic thermal simulation and modelling of micro- and nano-electronics

Bjorn Vermeersch (UGent) , Jedrzej Banaszczyk (UGent) and Gilbert De Mey (UGent)

(2006) 7th FirW PhD Symposium.

Academic Bibliography

Review on the integration of microelectronics for e-textile

Surface modification of an epoxy resin with polyamines and polydopamine: adhesion towards electroless deposited copper

Stuffing-enabled surface confinement of silanes used as sealing agents on CF4 plasma-exposed 2.0 p-OSG films

Atomic layer deposition of TiO₂ on surface modified nanoporous low-k films

Synthetic biology and microdevices : a powerful combination

A fixed-angle dynamic heat spreading model for (an)isotropic rear-cooled substrates

Dynamic thermal simulation and modelling of micro- and nano-electronics

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