Ghent University Academic Bibliography

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Review on the integration of microelectronics for e-textile

Abdella Simegnaw Ahmmed, Benny Malengier (UGent) , Gideon Rotich, Melkie Getnet Tadesse and Lieva Van Langenhove (UGent)

(2021) MATERIALS. 14(17).
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Influence of the interfacial transition zone on the chloride migration coefficient of portland cement concrete

Kai Wu (UGent) , Geert De Schutter (UGent) , Huisheng Shi, Guang Ye (UGent) and Yun Gao (UGent)

(2013) First International Conference on Concrete Sustainability, Proceedings. p.612-617
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On the mathematical structure of balanced chemical reaction networks governed by mass action kinetics

Arjan van der Schaft, Shodhan Rao (UGent) and Bayu Jayawardhana

(2013) SIAM JOURNAL ON APPLIED MATHEMATICS. 73(2). p.953-973
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Packaging of opto-electronic devices for flexible applications

Erwin Bosman (UGent) , Geert Van Steenberge (UGent) , Jeroen Missinne (UGent) , Bram Van Hoe (UGent) and Peter Van Daele (UGent)

(2010) Proceedings of SPIE, the International Society for Optical Engineering. 7607.
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Optical connections on flexible substrates

Erwin Bosman (UGent) , Peter Geerinck (UGent) , Wim Christiaens (UGent) , Geert Van Steenberge (UGent) , Jan Vanfleteren (UGent) and Peter Van Daele (UGent)

(2006) Proceedings of SPIE, the International Society for Optical Engineering.
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- Conference Paper
- P1
An O/E measurement probe based on an optics-extended MCM-D motherboard technology

Herbert De Pauw (UGent) , Johan De Baets (UGent) , Jan Vanfleteren (UGent) and André Van Calster (UGent)

(2002) PROCEEDINGS OF THE SOCIETY OF PHOTO-OPTICAL INSTRUMENTATION ENGINEERS (SPIE). 4931. p.936-941
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- Conference Paper
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Novel electroless bumping technologies for MCM-D : bumping of single chips and straight-wall bumping on Cu metallisations

Herbert De Pauw (UGent) , Jan Vanfleteren (UGent) , Johan De Baets (UGent) and André Van Calster (UGent)

(2001) PROCEEDINGS OF THE SOCIETY OF PHOTO-OPTICAL INSTRUMENTATION ENGINEERS (SPIE). 4428. p.302-307
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- Journal Article
- A1
Integrated optic devices based on nonlinear optical polymers

E. Van Tomme, Peter Van Daele (UGent) , Roel Baets (UGent) and Paul Lagasse

(1991) IEEE JOURNAL OF QUANTUM ELECTRONICS. 27(3). p.778-787

Academic Bibliography

Review on the integration of microelectronics for e-textile

Influence of the interfacial transition zone on the chloride migration coefficient of portland cement concrete

On the mathematical structure of balanced chemical reaction networks governed by mass action kinetics

Packaging of opto-electronic devices for flexible applications

Optical connections on flexible substrates

An O/E measurement probe based on an optics-extended MCM-D motherboard technology

Novel electroless bumping technologies for MCM-D : bumping of single chips and straight-wall bumping on Cu metallisations

Integrated optic devices based on nonlinear optical polymers

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