Ghent University Academic Bibliography

Journal Article
A1
open access

Al3Sc thin films for advanced interconnect applications

Jean -Philippe Soulie, Kiroubanand Sankaran, Valeria Founta, Karl Opsomer, Christophe Detavernier (UGent) , Joris Van de Vondel, Geoffrey Pourtois, Zsolt Tokei, Johan Swerts and Christoph Adelmann

(2024) MICROELECTRONIC ENGINEERING. 286.

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Conference Paper
P1
open access

Accurate characterization of radiation from interconnects on interposer at mmWave frequencies

Martijn Huynen (UGent) , Dries Bosman, Arno Moerman (UGent) and Dries Vande Ginste (UGent)

(2022) 2022 IEEE 26TH WORKSHOP ON SIGNAL AND POWER INTEGRITY (SPI). In IEEE Workshop on Signal and Power Integrity

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Rigorous full-wave resistance and inductance computation of 3-D interconnects

Martijn Huynen (UGent) , Daniël De Zutter (UGent) and Dries Vande Ginste (UGent)

(2018) IEEE MICROWAVE AND WIRELESS COMPONENTS LETTERS. 28(6). p.455-457

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Conference Paper
P1
open access

A novel methodology to create generative statistical models of interconnects

Simon De Ridder, Paolo Manfredi (UGent) , Jan De Geest, Tom Dhaene (UGent) , Daniël De Zutter (UGent) and Dries Vande Ginste (UGent)

(2016) 2016 IEEE ELECTRICAL DESIGN OF ADVANCED PACKAGING AND SYSTEMS (EDAPS) SYMPOSIUM. In IEEE Conference on Electrical Performance of Electronic Packaging and Systems-EPEPS p.69-71

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Silicon Photonic Integration Platform : have we found the sweet spot?

Dan-Xia Xu, Jens H. Schmid, Graham T. Reed, Goran Z. Mashanovich, David J. Thomson, Milos Nedeljkovic, Xia Chen, Dries Van Thourhout (UGent) , Shahram Keyvaninia (UGent) and shankar kumar Selvaraja (UGent)

(2014) IEEE JOURNAL OF SELECTED TOPICS IN QUANTUM ELECTRONICS. 20(4).

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Reliability of a stretchable interconnect utilizing terminated, in-plane meandered copper conductor

Michal Jablonski (UGent) , Frederick Bossuyt (UGent) , Jan Vanfleteren (UGent) , Thomas Vervust (UGent) and Hans de Vries

(2013) MICROELECTRONICS RELIABILITY. 53(7). p.956-963

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Polytypic InP Nanolaser Monolithically Integrated on (001) Silicon

Zhechao Wang (UGent) , Bin Tian (UGent) , M Paladugu, M Pantouvaki, Nicolas Le Thomas (UGent) , C Merckling, WM Guo, J Dekoster, J Van Campenhout, P Absil, et al.

(2013) NANO LETTERS. 13(11). p.5063-5069

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Nucleation and growth of copper on Ru-based substrates, I : the effect of the inorganic components

Magi Margalit Nagar (UGent) , Philippe M Vereecken, Katrien Strubbe (UGent) and Alexandar Radisic

(2012) ECS Transactions. 41(35). p.75-82

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ALD-grown seed layers for electrochemical copper deposition integrated with different diffusion barrier systems

Thomas Waechtler, Shao-Feng Ding, Lutz Hofmann, Robert Mothes, Qi Xie (UGent) , Steffen Oswald, Christophe Detavernier (UGent) , Stefan E Schulz, Xin-Ping Qu, Heinrich Lang, et al.

(2011) MICROELECTRONIC ENGINEERING. 88(5). p.684-689

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Miscellaneous
open access

Predicting the Performance of Reconfigurable Interconnects in Distributed Shared-Memory Systems

Wim Heirman (UGent) , Joni Dambre (UGent) , I ARTUNDO, C DEBAES, Hugo Thienpont (UGent) , Dirk Stroobandt (UGent) and Jan Van Campenhout (UGent)

(2006) Architectures and Compilers for Embedded Systems (ACES`06): Symposium Proceedings. p.31-34

Academic Bibliography

Al3Sc thin films for advanced interconnect applications

Accurate characterization of radiation from interconnects on interposer at mmWave frequencies

Rigorous full-wave resistance and inductance computation of 3-D interconnects

A novel methodology to create generative statistical models of interconnects

Silicon Photonic Integration Platform : have we found the sweet spot?

Reliability of a stretchable interconnect utilizing terminated, in-plane meandered copper conductor

Polytypic InP Nanolaser Monolithically Integrated on (001) Silicon

Nucleation and growth of copper on Ru-based substrates, I : the effect of the inorganic components

ALD-grown seed layers for electrochemical copper deposition integrated with different diffusion barrier systems

Predicting the Performance of Reconfigurable Interconnects in Distributed Shared-Memory Systems

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