Show 100 5 10 15 20 50 100 250 Sort by year (new to old) Actions Download search results Subscribe to news feed Your filters: cql: keyword exact "integrated circuit packaging" Add to list Journal Article A1 Polyimide-enhanced stretchable interconnects: design, fabrication, and characterization Yung-Yu Hsu, Mario Gonzalez, Frederick Bossuyt (UGent) , Jan Vanfleteren (UGent) and Ingrid De Wolf (2011) IEEE TRANSACTIONS ON ELECTRON DEVICES. 58(8). p.2680-2688