Ghent University Academic Bibliography

Your filters: cql: keyword exact "flip-chip"

Add to list
Mid-infrared dual-comb QCLs integrated with beam combiner based on Ge-on-Si platform

Dongbo Wang (UGent) , Harindra Kumar Kannojia (UGent) , Pierre Jouy, Etienne Giraud, Geert Van Steenberge (UGent) and Bart Kuyken (UGent)

(2023) 2023 IEEE SILICON PHOTONICS CONFERENCE, SIPHOTONICS.
Add to list
- Journal Article
- A1
- open access
Flip-chip assembly of VCSELs to silicon grating couplers via laser fabricated SU8 prisms

Kamalpreet Kaur (UGent) , Ananth Subramanian (UGent) , Paolo Cardile (UGent) , Rik Verplancke (UGent) , Joris Van Kerrebrouck (UGent) , Silvia Spiga, Ralf Meyer, Johan Bauwelinck (UGent) , Roel Baets (UGent) and Geert Van Steenberge (UGent)

(2015) OPTICS EXPRESS. 23(22). p.28264-28270
Add to list
Flip-chip bonding of vertical-cavity surface-emitting lasers using laser-induced forward transfer

Kamalpreet Kaur (UGent) , Jeroen Missinne (UGent) and Geert Van Steenberge (UGent)

(2014) APPLIED PHYSICS LETTERS. 104(6).
Add to list
- Conference Paper
- C3
- open access
Fluxless flip-chip bonding of single photodetector chips using laser-induced forward transfer

Kamalpreet Kaur (UGent) and Geert Van Steenberge (UGent)

(2014) Integrated Photonics Research, Silicon and Nanophotonics, Abstracts.
Add to list
- Conference Paper
- P1
- open access
Assembly of optoelectronics for efficient chip-to-waveguide coupling

Erwin Bosman (UGent) , Kamalpreet Kaur (UGent) , Jeroen Missinne (UGent) , Bram Van Hoe (UGent) and Geert Van Steenberge (UGent)

(2013) PROCEEDINGS OF THE 2013 IEEE 15TH ELECTRONICS PACKAGING TECHNOLOGY CONFERENCE (EPTC 2013). In Electronics Packaging Technology Conference Proceedings p.625-629
Add to list
- Journal Article
- A1
Foil-to-foil lamination and electrical interconnection of printed components on flexible substrates

Andrés Felipe Vasquez Quintero (UGent) , B Van Remoortere, ECP Smits, J van den Brand, D Briand, HFM Schoo and NF de Rooij

(2013) MICROELECTRONIC ENGINEERING. 110. p.52-58
Add to list
- Conference Paper
- P1
Novel electroless bumping technologies for MCM-D : bumping of single chips and straight-wall bumping on Cu metallisations

Herbert De Pauw (UGent) , Jan Vanfleteren (UGent) , Johan De Baets (UGent) and André Van Calster (UGent)

(2001) PROCEEDINGS OF THE SOCIETY OF PHOTO-OPTICAL INSTRUMENTATION ENGINEERS (SPIE). 4428. p.302-307

Academic Bibliography

Mid-infrared dual-comb QCLs integrated with beam combiner based on Ge-on-Si platform

Flip-chip assembly of VCSELs to silicon grating couplers via laser fabricated SU8 prisms

Flip-chip bonding of vertical-cavity surface-emitting lasers using laser-induced forward transfer

Fluxless flip-chip bonding of single photodetector chips using laser-induced forward transfer

Assembly of optoelectronics for efficient chip-to-waveguide coupling

Foil-to-foil lamination and electrical interconnection of printed components on flexible substrates

Novel electroless bumping technologies for MCM-D : bumping of single chips and straight-wall bumping on Cu metallisations

Contents

Support

Contact