Show 10 5 10 15 20 50 100 250 Sort by year (new to old) Actions Download search results Subscribe to news feed Your filters: cql: keyword exact "Vacuum lamination" Add to list Conference Paper P1 open access Vacuum lamination of a stretchable sensor system in polypropylene Pieter Bauwens (UGent) , Frederick Bossuyt (UGent) , Jan Patrick Deckers and Jan Vanfleteren (UGent) (2020) 2020 IEEE 8th Electronics System-Integration Technology Conference (ESTC). Add to list Journal Article A1 3D stacking of ultrathin chip packages: an innovative packaging and interconnection technology Swarnakamal Priyabadini (UGent) , Tom Sterken (UGent) , Luc Van Hoorebeke (UGent) and Jan Vanfleteren (UGent) (2013) IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY. 3(7). p.1114-1122 Add to list Conference Paper C1 3D-stacking of UTCPs as a module miniaturization technology Swarnakamal Priyabadini (UGent) , An Gielen (UGent) , Kristof Dhaenens (UGent) , Wim Christiaens (UGent) , Steven Van Put (UGent) , Gerhard Kunkel, Anders Erik Petersen and Jan Vanfleteren (UGent) (2011) 44th International Symposium on Microelectronics, Proceedings. p.463-468