Ghent University Academic Bibliography

Your filters: cql: keyword exact "Reactive magnetron sputtering"

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- Journal Article
- A1
- open access
Modeling reactive magnetron sputtering : opportunities and challenges

Diederik Depla (UGent) , Koen Strijckmans (UGent) , Dulmaa Altangerel, Florian Cougnon, Robin Dedoncker, Roeland Schelfhout, Isabella Schramm (UGent) , Filip Moens and Roger De Gryse (UGent)

(2019) THIN SOLID FILMS. 688.
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Effect of space charge on the negative oxygen flux during reactive sputtering

Filip Moens, T Kalvas, Sigelinde Van Steenberge and Diederik Depla (UGent)

(2017) JOURNAL OF PHYSICS D-APPLIED PHYSICS. 50(11).
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Hysteresis behavior during facing target magnetron sputtering

Florian Cougnon, Koen Strijckmans (UGent) , Roeland Schelfhout and Diederik Depla (UGent)

(2016) SURFACE & COATINGS TECHNOLOGY. 294. p.215-219
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- Conference Paper
- C3
- open access
Sputter deposited transition metal nitrides as back electrode for CIGS solar cells

Wouter Leroy (UGent) , Stijn Mahieu (UGent) and Diederik Depla (UGent)

(2011) E-MRS Spring Meeting, Abstracts.
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- Journal Article
- A4
Using Mass Spectrometry to gather some insights in the fundamentals if the reactive magnetron sputtering process of Al with O2

Wouter Leroy (UGent) , Stijn Mahieu (UGent) , Rosita Persoons and Diederik Depla (UGent)

(2009) Nevac Blad. 47(2). p.10-14
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Quantification of the incorporation coefficient of a reactive gas on a metallic film during magnetron sputtering: the method and results

Wouter Leroy (UGent) , Stijn Mahieu (UGent) , Rosita Persoons and Diederik Depla (UGent)

(2009) THIN SOLID FILMS. 518(5). p.1527-1531

Academic Bibliography

Modeling reactive magnetron sputtering : opportunities and challenges

Effect of space charge on the negative oxygen flux during reactive sputtering

Hysteresis behavior during facing target magnetron sputtering

Sputter deposited transition metal nitrides as back electrode for CIGS solar cells

Using Mass Spectrometry to gather some insights in the fundamentals if the reactive magnetron sputtering process of Al with O2

Quantification of the incorporation coefficient of a reactive gas on a metallic film during magnetron sputtering: the method and results

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