Show 10 5 10 15 20 50 100 250 Sort by year (new to old) Actions Download search results Subscribe to news feed Your filters: cql: keyword exact "Multi-UTCP" Add to list Journal Article A1 3D stacking of ultrathin chip packages: an innovative packaging and interconnection technology Swarnakamal Priyabadini (UGent) , Tom Sterken (UGent) , Luc Van Hoorebeke (UGent) and Jan Vanfleteren (UGent) (2013) IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY. 3(7). p.1114-1122