Ghent University Academic Bibliography

Show Sort by

Your filters: cql: keyword exact "3-D surface admittance"

Add to list
- Conference Paper
- P1
- open access
An enhanced differential surface admittance operator for the signal integrity modeling of interconnects

Martijn Huynen (UGent) , Kamil Yavuz Kapusuz (UGent) , Daniël De Zutter (UGent) and Dries Vande Ginste (UGent)

(2019) PROCEEDINGS OF THE 2019 INTERNATIONAL CONFERENCE ON ELECTROMAGNETICS IN ADVANCED APPLICATIONS (ICEAA). p.61-66
Add to list
Broadband 3-D boundary integral equation characterization of composite conductors

Martijn Huynen (UGent) , Daniël De Zutter (UGent) and Dries Vande Ginste (UGent)

(2019) 2019 IEEE 28TH CONFERENCE ON ELECTRICAL PERFORMANCE OF ELECTRONIC PACKAGING AND SYSTEMS (EPEPS 2019).
Add to list
Rigorous full-wave resistance and inductance computation of 3-D interconnects

Martijn Huynen (UGent) , Daniël De Zutter (UGent) and Dries Vande Ginste (UGent)

(2018) IEEE MICROWAVE AND WIRELESS COMPONENTS LETTERS. 28(6). p.455-457
Add to list
- Conference Paper
- P1
- open access
A fully 3-D BIE evaluation of the resistance and inductance of on-board and on-chip interconnects

Martijn Huynen (UGent) , Daniël De Zutter (UGent) and Dries Vande Ginste (UGent)

(2018) 2018 IEEE 22ND WORKSHOP ON SIGNAL AND POWER INTEGRITY (SPI). In IEEE Workshop on Signal and Power Integrity
Add to list
- Conference Paper
- P1
- open access
Broadband full-wave BIE impedance characterization of 3-D interconnects

Martijn Huynen (UGent) , Daniël De Zutter (UGent) and Dries Vande Ginste (UGent)

(2018) 2018 IEEE 27TH CONFERENCE ON ELECTRICAL PERFORMANCE OF ELECTRONIC PACKAGING AND SYSTEMS (EPEPS). In IEEE Conference on Electrical Performance of Electronic Packaging and Systems-EPEPS p.241-243

Academic Bibliography

An enhanced differential surface admittance operator for the signal integrity modeling of interconnects

Broadband 3-D boundary integral equation characterization of composite conductors

Rigorous full-wave resistance and inductance computation of 3-D interconnects

A fully 3-D BIE evaluation of the resistance and inductance of on-board and on-chip interconnects

Broadband full-wave BIE impedance characterization of 3-D interconnects

Contents

Support

Contact