Ghent University Academic Bibliography

Conference Paper
P1
open access

Interconnect modeling using a surface admittance operator derived with the Fokas method

Dries Bosman (UGent) , Martijn Huynen (UGent) , Daniël De Zutter (UGent) , Xiao Sun, Nicolas Pantano, Geert Van der Plas, Eric Beyne and Dries Vande Ginste (UGent)

(2022) 2022 IEEE 31ST CONFERENCE ON ELECTRICAL PERFORMANCE OF ELECTRONIC PACKAGING AND SYSTEMS (EPEPS 2022). In IEEE Conference on Electrical Performance of Electronic Packaging and Systems-EPEPS

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Analysis of the influence of roughness on the propagation constant of a waveguide via two sparse stochastic methods

Ruben Waeytens (UGent) , Dries Bosman (UGent) , Martijn Huynen (UGent) , Michiel Gossye, Hendrik Rogier (UGent) and Dries Vande Ginste (UGent)

(2020) 2020 IEEE 29th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS). In IEEE Conference on Electrical Performance of Electronic Packaging and Systems-EPEPS

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Broadband 3-D boundary integral equation characterization of composite conductors

Martijn Huynen (UGent) , Daniël De Zutter (UGent) and Dries Vande Ginste (UGent)

(2019) 2019 IEEE 28TH CONFERENCE ON ELECTRICAL PERFORMANCE OF ELECTRONIC PACKAGING AND SYSTEMS (EPEPS 2019).

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Conference Paper
P1
open access

Autoencoding density-based anomaly detection for signal integrity applications

Roberto Medico, Domenico Spina (UGent) , Dries Vande Ginste (UGent) , Dirk Deschrijver (UGent) and Tom Dhaene (UGent)

(2018) 2018 IEEE 27TH CONFERENCE ON ELECTRICAL PERFORMANCE OF ELECTRONIC PACKAGING AND SYSTEMS (EPEPS). In IEEE Conference on Electrical Performance of Electronic Packaging and Systems-EPEPS p.47-49

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Conference Paper
P1
open access

Broadband full-wave BIE impedance characterization of 3-D interconnects

Martijn Huynen (UGent) , Daniël De Zutter (UGent) and Dries Vande Ginste (UGent)

(2018) 2018 IEEE 27TH CONFERENCE ON ELECTRICAL PERFORMANCE OF ELECTRONIC PACKAGING AND SYSTEMS (EPEPS). In IEEE Conference on Electrical Performance of Electronic Packaging and Systems-EPEPS p.241-243

Academic Bibliography

Interconnect modeling using a surface admittance operator derived with the Fokas method

Analysis of the influence of roughness on the propagation constant of a waveguide via two sparse stochastic methods

Broadband 3-D boundary integral equation characterization of composite conductors

Autoencoding density-based anomaly detection for signal integrity applications

Broadband full-wave BIE impedance characterization of 3-D interconnects

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