Ghent University Academic Bibliography

Conference Paper
C1
open access

Broadband impedance response extraction of on-chip interdigital capacitors using a 3-D DSA operator for piecewise homogeneous structures

Tim Pattyn (UGent) , Xiao Sun, Eric Beyne, Daniël De Zutter (UGent) , Martijn Huynen (UGent) and Dries Vande Ginste (UGent)

(2025) 2025 IEEE 34th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS). p.1-3

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Conference Paper
P1
open access

Accuracy study of the differential surface admittance operator for lossy metal characterization

Martijn Huynen (UGent) , V. Okhmatovksi, Daniël De Zutter (UGent) and Dries Vande Ginste (UGent)

(2024) 2024 IEEE 33RD CONFERENCE ON ELECTRICAL PERFORMANCE OF ELECTRONIC PACKAGING AND SYSTEMS, EPEPS 2024. In IEEE Conference on Electrical Performance of Electronic Packaging and Systems p.1-3

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Conference Paper
P1
open access

Modeling microwave S-parameters using frequency-scaled rational Gaussian process kernels

Thijs Ullrick (UGent) , Dirk Deschrijver (UGent) , Wim Bogaerts (UGent) and Tom Dhaene (UGent)

(2024) 2024 IEEE 33RD CONFERENCE ON ELECTRICAL PERFORMANCE OF ELECTRONIC PACKAGING AND SYSTEMS, EPEPS 2024. In IEEE Conference on Electrical Performance of Electronic Packaging and Systems

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Conference Paper
P1
open access

Substrate integrated coaxial line millimeterwave components manufactured in standard PCB

Laura Van Messem, Arno Moerman (UGent) , Olivier Caytan (UGent) , Hendrik Rogier (UGent) and Sam Lemey (UGent)

(2023) 2023 IEEE 32nd Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS). In IEEE Conference on Electrical Performance of Electronic Packaging and Systems-EPEPS

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Conference Paper
P1
open access

Interconnect modeling using a surface admittance operator derived with the Fokas method

Dries Bosman, Martijn Huynen (UGent) , Daniël De Zutter (UGent) , Xiao Sun, Nicolas Pantano, Geert Van der Plas, Eric Beyne and Dries Vande Ginste (UGent)

(2022) 2022 IEEE 31ST CONFERENCE ON ELECTRICAL PERFORMANCE OF ELECTRONIC PACKAGING AND SYSTEMS (EPEPS 2022). In IEEE Conference on Electrical Performance of Electronic Packaging and Systems-EPEPS

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Analysis of the influence of roughness on the propagation constant of a waveguide via two sparse stochastic methods

Ruben Waeytens, Dries Bosman, Martijn Huynen (UGent) , Michiel Gossye, Hendrik Rogier (UGent) and Dries Vande Ginste (UGent)

(2020) 2020 IEEE 29th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS). In IEEE Conference on Electrical Performance of Electronic Packaging and Systems-EPEPS

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Broadband 3-D boundary integral equation characterization of composite conductors

Martijn Huynen (UGent) , Daniël De Zutter (UGent) and Dries Vande Ginste (UGent)

(2019) 2019 IEEE 28TH CONFERENCE ON ELECTRICAL PERFORMANCE OF ELECTRONIC PACKAGING AND SYSTEMS (EPEPS 2019).

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Conference Paper
P1
open access

Broadband full-wave BIE impedance characterization of 3-D interconnects

Martijn Huynen (UGent) , Daniël De Zutter (UGent) and Dries Vande Ginste (UGent)

(2018) 2018 IEEE 27TH CONFERENCE ON ELECTRICAL PERFORMANCE OF ELECTRONIC PACKAGING AND SYSTEMS (EPEPS). In IEEE Conference on Electrical Performance of Electronic Packaging and Systems-EPEPS p.241-243

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Conference Paper
P1
open access

Autoencoding density-based anomaly detection for signal integrity applications

Roberto Medico, Domenico Spina (UGent) , Dries Vande Ginste (UGent) , Dirk Deschrijver (UGent) and Tom Dhaene (UGent)

(2018) 2018 IEEE 27TH CONFERENCE ON ELECTRICAL PERFORMANCE OF ELECTRONIC PACKAGING AND SYSTEMS (EPEPS). In IEEE Conference on Electrical Performance of Electronic Packaging and Systems-EPEPS p.47-49

Academic Bibliography

Broadband impedance response extraction of on-chip interdigital capacitors using a 3-D DSA operator for piecewise homogeneous structures

Accuracy study of the differential surface admittance operator for lossy metal characterization

Modeling microwave S-parameters using frequency-scaled rational Gaussian process kernels

Substrate integrated coaxial line millimeterwave components manufactured in standard PCB

Interconnect modeling using a surface admittance operator derived with the Fokas method

Analysis of the influence of roughness on the propagation constant of a waveguide via two sparse stochastic methods

Broadband 3-D boundary integral equation characterization of composite conductors

Broadband full-wave BIE impedance characterization of 3-D interconnects

Autoencoding density-based anomaly detection for signal integrity applications

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