Ghent University Academic Bibliography

Broadband 3-D boundary integral equation characterization of composite conductors

Martijn Huynen (UGent) , Daniël De Zutter (UGent) and Dries Vande Ginste (UGent)

(2019) 2019 IEEE 28TH CONFERENCE ON ELECTRICAL PERFORMANCE OF ELECTRONIC PACKAGING AND SYSTEMS (EPEPS 2019).

Conference Paper
P1
open access

Broadband full-wave BIE impedance characterization of 3-D interconnects

Martijn Huynen (UGent) , Daniël De Zutter (UGent) and Dries Vande Ginste (UGent)

(2018) 2018 IEEE 27TH CONFERENCE ON ELECTRICAL PERFORMANCE OF ELECTRONIC PACKAGING AND SYSTEMS (EPEPS). In IEEE Conference on Electrical Performance of Electronic Packaging and Systems-EPEPS p.241-243

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Conference Paper
P1
open access

The relationship between Galerkin and collocation methods in statistical transmission line analysis

Paolo Manfredi (UGent) , Daniël De Zutter (UGent) and Dries Vande Ginste (UGent)

(2016) 2016 IEEE 25TH CONFERENCE ON ELECTRICAL PERFORMANCE OF ELECTRONIC PACKAGING AND SYSTEMS (EPEPS). In IEEE Conference on Electrical Performance of Electronic Packaging and Systems-EPEPS p.35-37

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Conference Paper
P1
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A novel methodology to create generative statistical models of interconnects

Simon De Ridder, Paolo Manfredi (UGent) , Jan De Geest, Tom Dhaene (UGent) , Daniël De Zutter (UGent) and Dries Vande Ginste (UGent)

(2016) 2016 IEEE ELECTRICAL DESIGN OF ADVANCED PACKAGING AND SYSTEMS (EDAPS) SYMPOSIUM. In IEEE Conference on Electrical Performance of Electronic Packaging and Systems-EPEPS p.69-71

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P1
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Macromodeling of general linear systems under stochastic variations

Yinghao Ye, Domenico Spina (UGent) , Tom Dhaene (UGent) , Luc Knockaert (UGent) and Giulio Antonini

(2016) 2016 IEEE ELECTRICAL DESIGN OF ADVANCED PACKAGING AND SYSTEMS (EDAPS) SYMPOSIUM. In IEEE Conference on Electrical Performance of Electronic Packaging and Systems-EPEPS p.61-63

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Conference Paper
P1
open access

A perturbation technique to analyze the influence of fiber weave effects on differential signaling

Mykola Chernobryvko (UGent) , Dries Vande Ginste (UGent) and Daniël De Zutter (UGent)

(2013) 2013 IEEE 22ND CONFERENCE ON ELECTRICAL PERFORMANCE OF ELECTRONIC PACKAGING AND SYSTEMS (EPEPS). p.15-18

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Conference Paper
P1
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SPICE-based statistical assessment of interconnects terminated by nonlinear loads with polynomial characteristics

Paolo Manfredi, Alessandro Biondi (UGent) , Dries Vande Ginste (UGent) , Daniël De Zutter (UGent) and Flavio Canavero

(2013) IEEE Conference on Electrical Performance of Electronic Packaging and Systems-EPEPS. p.99-102

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P1
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Frequency- and time-domain stochastic analysis of lossy and dispersive interconnects in a SPICE-like environment

Paolo Manfredi, Dries Vande Ginste (UGent) , Daniël De Zutter (UGent) and Flavio Canavero

(2012) IEEE Conference on Electrical Performance of Electronic Packaging and Systems-EPEPS. p.65-68

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P1
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A discussion of an analytical per-unit-length impedance matrix model

Frédéric Broydé, Evelyne Clavelier, Daniël De Zutter (UGent) and Dries Vande Ginste (UGent)

(2012) IEEE Conference on Electrical Performance of Electronic Packaging and Systems-EPEPS. p.113-116

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P1
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Sequential sampling strategy for the modeling of parameterized microwave and RF components

Dirk Deschrijver (UGent) , Karel Crombecq (UGent) , Huu Minh Nguyen and Tom Dhaene (UGent)

(2011) IEEE Conference on Electrical Performance of Electronic Packaging and Systems-EPEPS. p.45-48

Academic Bibliography

Broadband 3-D boundary integral equation characterization of composite conductors

Broadband full-wave BIE impedance characterization of 3-D interconnects

The relationship between Galerkin and collocation methods in statistical transmission line analysis

A novel methodology to create generative statistical models of interconnects

Macromodeling of general linear systems under stochastic variations

A perturbation technique to analyze the influence of fiber weave effects on differential signaling

SPICE-based statistical assessment of interconnects terminated by nonlinear loads with polynomial characteristics

Frequency- and time-domain stochastic analysis of lossy and dispersive interconnects in a SPICE-like environment

A discussion of an analytical per-unit-length impedance matrix model

Sequential sampling strategy for the modeling of parameterized microwave and RF components

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