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Efficient characterization of interconnects with arbitrary polygonal cross sections using fokas-derived Dirichlet-to-Neumann operators
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Fabrication of a shear stress sensor matrix using standard printed circuit board and overmolding technologies
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Stretchable mould interconnect optimization : peeling automation and carrierless techniques
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Machine-learning-based error detection and design optimization in signal integrity applications
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A generative modeling framework for statistical link analysis based on sparse data
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Arbitrarily shaped rigid and smart objects using stretchable interconnections
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Effective electrothermal analysis of electronic devices and systems with parameterized macromodeling
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Efficient variability analysis of electromagnetic systems via polynomial chaos and model order reduction
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Nonuniform multiconductor transmission line analysis by a two-step perturbation technique
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High yield fabrication process for 3D-stacked ultra-thin chip packages using photo-definable polyimide and symmetry in packages