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- Conference Paper
- C1
- open access
Active and passive component embedding into low-cost plastic substrates aimed at smart system applications
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Fabrication and characterization of flexible ultrathin chip package using photosensitive polyimide
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- Conference Paper
- C1
- open access
Technology development for a low-cost, roll-to-roll chip embedding solution based on PET foils
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- PhD Thesis
- open access
High-frequency characterization of embedded components in printed circuit boards
(2010)