Ghent University Academic Bibliography

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XPS-study of Cu/epoxy Interfaces after different Wet Chemical Treatments

Sam Siau, B DE ROO and Alfons Vervaet (UGent)

(2007) 211th ECS Meeting - Chicago, Illinois F1 - Electrochemical Processing in ULSI and MEMS 3-Electrodeposition.
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Qualitative electroless Ni/Au plating considerations for the solder mask on top of sequential build-up layers

Sam Siau, Alfons Vervaet (UGent) , Lieven Degrendele (UGent) , Johan De Baets (UGent) and André Van Calster (UGent)

(2006) APPLIED SURFACE SCIENCE. 252(8). p.2717-2740
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Optimization of microvia-technology using excimer laser for build-up layer application in microelectronics

Alfons Vervaet (UGent) , Sam Siau, Johan De Baets (UGent) and Boniface Manirambona (UGent)

(2006) APPLIED SURFACE SCIENCE. 252(23). p.8243-8250
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Epoxy polymer surface modification through wet-chemical organic surface synthesis for adhesion improvement in microelectronics

Sam Siau, Alfons Vervaet (UGent) , Etienne Schacht (UGent) , Ulric Demeter (UGent) and André Van Calster (UGent)

(2006) THIN SOLID FILMS. 495(1-2). p.348-356
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Study of the failure mechanism of the Cu/epoxy interface after modifications by means of surface chemical reactions

Sam Siau and Alfons Vervaet (UGent)

(2006) ECS Transactions. 3(21). p.123-132
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Improvement of copper adhesion by chemical modification of epoxy surfaces.

B DE ROO, Alfons Vervaet (UGent) , Etienne Schacht (UGent) , An Gielen (UGent) , Johan De Baets (UGent) and André Van Calster (UGent)

(2006) 7e FirW Doctoraatssymposium, papers.
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Dip coating of dielectric and solder mask epoxy polymer layers for build-up purposes

Sam Siau, Alfons Vervaet (UGent) , S DEGRANDE, Etienne Schacht (UGent) and André Van Calster (UGent)

(2005) APPLIED SURFACE SCIENCE. 245(1-4). p.353-368
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Chemical modification of buildup epoxy surfaces for altering the adhesion of electrochemically deposited copper

Sam Siau, Alfons Vervaet (UGent) , Etienne Schacht (UGent) , S DEGRANDE, Katrien Callewaert and André Van Calster (UGent)

(2005) JOURNAL OF THE ELECTROCHEMICAL SOCIETY. 152(9).
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Adhesion strength of the epoxy polymer/copper interface for use in microelectronics

Sam Siau, Alfons Vervaet (UGent) , L VAN VAECK, Etienne Schacht (UGent) , Ulric Demeter (UGent) and André Van Calster (UGent)

(2005) JOURNAL OF THE ELECTROCHEMICAL SOCIETY. 152(6).
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Interface evolution of epoxy layers due to wetchemical treatments and its relevance to adhesion of electrochemically deposited copper

Sam Siau, Alfons Vervaet (UGent) , Etienne Schacht (UGent) and André Van Calster (UGent)

(2005) Meeting abstracts of the 207th Meeting 2005 The Electrochemical Society.. p.348-348

Academic Bibliography

XPS-study of Cu/epoxy Interfaces after different Wet Chemical Treatments

Qualitative electroless Ni/Au plating considerations for the solder mask on top of sequential build-up layers

Optimization of microvia-technology using excimer laser for build-up layer application in microelectronics

Epoxy polymer surface modification through wet-chemical organic surface synthesis for adhesion improvement in microelectronics

Study of the failure mechanism of the Cu/epoxy interface after modifications by means of surface chemical reactions

Improvement of copper adhesion by chemical modification of epoxy surfaces.

Dip coating of dielectric and solder mask epoxy polymer layers for build-up purposes

Chemical modification of buildup epoxy surfaces for altering the adhesion of electrochemically deposited copper

Adhesion strength of the epoxy polymer/copper interface for use in microelectronics

Interface evolution of epoxy layers due to wetchemical treatments and its relevance to adhesion of electrochemically deposited copper

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