Ghent University Academic Bibliography

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- Journal Article
- A1
Qualitative electroless Ni/Au plating considerations for the solder mask on top of sequential build-up layers

Sam Siau, Alfons Vervaet (UGent) , Lieven Degrendele (UGent) , Johan De Baets (UGent) and André Van Calster (UGent)

(2006) APPLIED SURFACE SCIENCE. 252(8). p.2717-2740
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- Journal Article
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Optimization of microvia-technology using excimer laser for build-up layer application in microelectronics

Alfons Vervaet (UGent) , Sam Siau, Johan De Baets (UGent) and Boniface Manirambona (UGent)

(2006) APPLIED SURFACE SCIENCE. 252(23). p.8243-8250
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- Conference Paper
- C1
Improvement of copper adhesion by chemical modification of epoxy surfaces.

B DE ROO, Alfons Vervaet (UGent) , Etienne Schacht (UGent) , An Gielen (UGent) , Johan De Baets (UGent) and André Van Calster (UGent)

(2006) 7e FirW Doctoraatssymposium, papers.
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- Conference Paper
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Optimization of microvia-technology using an excimer laser for application in microelectronics

Boniface Manirambona (UGent) , Johan De Baets (UGent) and Alfons Vervaet (UGent)

(2003) E-MRS 2003 Spring Meeting, Book of Abstracts.
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- Journal Article
- A1
Excimer laser microvia-technology in multichip modules

Boniface Manirambona (UGent) , Johan De Baets (UGent) and Alfons Vervaet (UGent)

(2003) APPLIED SURFACE SCIENCE. 208. p.171-176
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- Journal Article
- A1
Stabilizer concentration and local environment: Their effects on electroless nickel plating of PCB micropads.

Suixin Zhang, Johan De Baets (UGent) , Maria Vereeken, Alfons Vervaet (UGent) and André Van Calster (UGent)

(1999) JOURNAL OF THE ELECTROCHEMICAL SOCIETY. 146(8). p.2870-2875
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- Miscellaneous
Electroless Nickel-Gold Stud Bumping on Laminate for Flip-Chip Assembly

S Zang, M Vereecken, Johan De Baets (UGent) , André Van Calster (UGent) , Alfons Vervaet (UGent) , J Peeters and Koenraad Allaert

(1997) Printed Circuit Board Technology, Fraunhofer-Institute /ZM, Hotel Intercontinental, Berlin, januari 1997.
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- Journal Article
- A1
Polycrystalline CdSe films for thin film transistors.

André Van Calster (UGent) , Alfons Vervaet (UGent) , Igor De Rycke, Johan De Baets (UGent) and Jan Vanfleteren (UGent)

(1988) JOURNAL OF CRYSTAL GROWTH. 86(1-4). p.924-928
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- Journal Article
- A1
A new technology for fast switching-circuits on glass

André Van Calster (UGent) , Igor DeRycke, Alfons Vervaet (UGent) , Johan De Baets (UGent) and Jan Vanfleteren (UGent)

(1987) IEEE ELECTRON DEVICE LETTERS. 8(10). p.477-479
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- Conference Paper
- C1
Polycrystalline CdSe films for Thin Film Transistors.

André Van Calster (UGent) , Alfons Vervaet (UGent) , Igor De Rycke and Johan De Baets (UGent)

(1987) The Seventh American Conference on Crystal Growth.

Academic Bibliography

Qualitative electroless Ni/Au plating considerations for the solder mask on top of sequential build-up layers

Optimization of microvia-technology using excimer laser for build-up layer application in microelectronics

Improvement of copper adhesion by chemical modification of epoxy surfaces.

Optimization of microvia-technology using an excimer laser for application in microelectronics

Excimer laser microvia-technology in multichip modules

Stabilizer concentration and local environment: Their effects on electroless nickel plating of PCB micropads.

Electroless Nickel-Gold Stud Bumping on Laminate for Flip-Chip Assembly

Polycrystalline CdSe films for thin film transistors.

A new technology for fast switching-circuits on glass

Polycrystalline CdSe films for Thin Film Transistors.

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