Ghent University Academic Bibliography

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- Journal Article
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Qualitative electroless Ni/Au plating considerations for the solder mask on top of sequential build-up layers

Sam Siau, Alfons Vervaet (UGent) , Lieven Degrendele (UGent) , Johan De Baets (UGent) and André Van Calster (UGent)

(2006) APPLIED SURFACE SCIENCE. 252(8). p.2717-2740
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Epoxy polymer surface modification through wet-chemical organic surface synthesis for adhesion improvement in microelectronics

Sam Siau, Alfons Vervaet (UGent) , Etienne Schacht (UGent) , Ulric Demeter (UGent) and André Van Calster (UGent)

(2006) THIN SOLID FILMS. 495(1-2). p.348-356
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- Conference Paper
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Improvement of copper adhesion by chemical modification of epoxy surfaces.

B DE ROO, Alfons Vervaet (UGent) , Etienne Schacht (UGent) , An Gielen (UGent) , Johan De Baets (UGent) and André Van Calster (UGent)

(2006) 7e FirW Doctoraatssymposium, papers.
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Dip coating of dielectric and solder mask epoxy polymer layers for build-up purposes

Sam Siau, Alfons Vervaet (UGent) , S DEGRANDE, Etienne Schacht (UGent) and André Van Calster (UGent)

(2005) APPLIED SURFACE SCIENCE. 245(1-4). p.353-368
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Chemical modification of buildup epoxy surfaces for altering the adhesion of electrochemically deposited copper

Sam Siau, Alfons Vervaet (UGent) , Etienne Schacht (UGent) , S DEGRANDE, Katrien Callewaert and André Van Calster (UGent)

(2005) JOURNAL OF THE ELECTROCHEMICAL SOCIETY. 152(9).
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Adhesion strength of the epoxy polymer/copper interface for use in microelectronics

Sam Siau, Alfons Vervaet (UGent) , L VAN VAECK, Etienne Schacht (UGent) , Ulric Demeter (UGent) and André Van Calster (UGent)

(2005) JOURNAL OF THE ELECTROCHEMICAL SOCIETY. 152(6).
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- Conference Paper
- C3
Interface evolution of epoxy layers due to wetchemical treatments and its relevance to adhesion of electrochemically deposited copper

Sam Siau, Alfons Vervaet (UGent) , Etienne Schacht (UGent) and André Van Calster (UGent)

(2005) Meeting abstracts of the 207th Meeting 2005 The Electrochemical Society.. p.348-348
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The Development of Epoxy Polymer Surface Roughness Due to Wet Chemical Treatments and its Relevance to Adhesion of Electrochemically Deposited Copper

Sam Siau, Alfons Vervaet (UGent) , André Van Calster (UGent) and Daniël Baert

(2005) Program of the Fifth International Symposium on Polymer Surface Modification. p.22-22
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- Conference Paper
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Epoxy polymer surface modification through wet-chemical organic surface synthesis for adhesion improvement in microelectronics

SABINE SIAU (UGent) , Alfons Vervaet (UGent) , André Van Calster (UGent) , Etienne Schacht (UGent) and Ulric Demeter (UGent)

(2005) Proceedings E-MRS 2005 Spring Meeting Strassbourg. p.E37-E38
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Influence of build-up epoxy layer surface roughness on the adhesion strength of electrochemically deposited copper

Sam Siau, Alfons Vervaet (UGent) , André Van Calster (UGent) and Etienne Schacht (UGent)

(2004) Electrochemical Society, 205th Meeting, Abstracts.

Academic Bibliography

Qualitative electroless Ni/Au plating considerations for the solder mask on top of sequential build-up layers

Epoxy polymer surface modification through wet-chemical organic surface synthesis for adhesion improvement in microelectronics

Improvement of copper adhesion by chemical modification of epoxy surfaces.

Dip coating of dielectric and solder mask epoxy polymer layers for build-up purposes

Chemical modification of buildup epoxy surfaces for altering the adhesion of electrochemically deposited copper

Adhesion strength of the epoxy polymer/copper interface for use in microelectronics

Interface evolution of epoxy layers due to wetchemical treatments and its relevance to adhesion of electrochemically deposited copper

The Development of Epoxy Polymer Surface Roughness Due to Wet Chemical Treatments and its Relevance to Adhesion of Electrochemically Deposited Copper

Epoxy polymer surface modification through wet-chemical organic surface synthesis for adhesion improvement in microelectronics

Influence of build-up epoxy layer surface roughness on the adhesion strength of electrochemically deposited copper

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