Show 10 5 10 15 20 50 100 250 Sort by year (new to old) Actions Download search results Subscribe to news feed Your filters: cql: author exact F3321BE8-F0ED-11E1-A9DE-61C894A0A6B4 cql: author exact 70493824-B25E-11E6-B104-2D2FD0AF0289 Add to list Miscellaneous Electroless Nickel-Gold Stud Bumping on Laminate for Flip-Chip Assembly S Zang, M Vereecken, Johan De Baets (UGent) , André Van Calster (UGent) , Alfons Vervaet (UGent) , J Peeters and Koenraad Allaert (1997) Printed Circuit Board Technology, Fraunhofer-Institute /ZM, Hotel Intercontinental, Berlin, januari 1997. Add to list Conference Paper C1 P.C.V.D. SIN Conformal Coatings for the Improvement of the Reliability of Wire Bonded Chips. Koenraad Allaert, André Van Calster (UGent) and Alfons Vervaet (UGent) (1986) International Symposium on the Physical and Failure Analysis of Integrated Circuits. Add to list Conference Paper C1 Evaluation of PCVD Silicon Nitride as a Total Passivation Layer for Chips. Koenraad Allaert, André Van Calster (UGent) and Alfons Vervaet (UGent) (1986) Proceedings of the 5th VLSI Packaging Workshop.