Show 10 5 10 15 20 50 100 250 Sort by year (new to old) Actions Download search results Subscribe to news feed Your filters: cql: author exact D9C47964-F04D-11E4-AA04-0665B5D1D7B1 or (type any "bookEditor journalEditor issueEdi... cql: keyword exact "adhesives" Add to list Journal Article A1 Flip-chip integration of Si bare dies on polymeric substrates at low temperature using ICA vias made in dry film photoresist Andrés Felipe Vasquez Quintero (UGent) , D Briand and NF de Rooij (2015) JOURNAL OF MICROMECHANICS AND MICROENGINEERING. 25(4). Add to list Journal Article A1 Foil-to-foil lamination and electrical interconnection of printed components on flexible substrates Andrés Felipe Vasquez Quintero (UGent) , B Van Remoortere, ECP Smits, J van den Brand, D Briand, HFM Schoo and NF de Rooij (2013) MICROELECTRONIC ENGINEERING. 110. p.52-58