Ghent University Academic Bibliography

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- Conference Paper
- P1
Photovia technology: Some important aspects for reliability

Suixin Zhang, Johan De Baets (UGent) , André Van Calster (UGent) , Dorina Corlatan, Pascal De Langhe and Koenraad Allaert

(1999) 1999 INTERNATIONAL SYMPOSIUM ON MICROELECTRONICS, PROCEEDINGS. p.240-245
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- Conference Paper
- C1
Photovia technology: Some important aspects for reliability.

Suixin Zhang, Johan De Baets (UGent) , André Van Calster (UGent) , Dorina Corlatan, P DE LANGHE and Koenraad Allaert

(1999) Proceedings of Imaps 99, Chicago, oktober 1999. p.240-245
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- Conference Paper
- C1
The realisation of photo-via technology using multiposit as a photo imageable dielectric

Suixin Zhang, Maria Vereeken, J DEBAETS, André Van Calster (UGent) , J PEETERS and Koenraad Allaert

(1998) Proceedings of the 3rd European Conference on Electronic Packaging Technology & 9th International Conference on Interconnection Technology in Electronics ( EuPac '98), DVS.juni. p.62-65
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- Miscellaneous
Electroless Nickel-Gold Stud Bumping on Laminate for Flip-Chip Assembly

S Zang, M Vereecken, Johan De Baets (UGent) , André Van Calster (UGent) , Alfons Vervaet (UGent) , J Peeters and Koenraad Allaert

(1997) Printed Circuit Board Technology, Fraunhofer-Institute /ZM, Hotel Intercontinental, Berlin, januari 1997.
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- Conference Paper
- C1
Development of an adhesive TAB joining technology

Jan Vanfleteren (UGent) , André Van Calster (UGent) , Kris Sabbe, M DE CALUWE, A DRAVET, P KERTESZ, S SECHER, K DECKELMANN, J WIESE, E CORTES, et al.

(1996) Proceeding of the European Conference on Electronic Packaging Technology, Vol. 173, Deutscher Verband für Schweisstechnik (DVS), Essen, Germany, januari. p.24-26
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- Journal Article
- A2
Interconnection Technology for Advanced High density Thick Films

M VRANA, André Van Calster (UGent) , R VANDEN BERGHE and Koenraad Allaert

(1996) Microelectronics International. 13(3). p.5-8
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- Conference Paper
- C1
Radiated emission of PCB tracks.

Pascal De Langhe, Femke Olyslager (UGent) , Ann Franchois (UGent) , Daniël De Zutter (UGent) and Koenraad Allaert

(1996) 2nd European Conference on Electronic Packaging Technology & 8th International Conference on Interconnection Technology in Electronics, 31 January - 2 February Essen, Germany. p.140-142
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- Conference Paper
- C1
Characterization of integrated resistors for broadband telecom printed circuit boards

J PEETERS, Ann Ackaert (UGent) , L VANDAM, Koenraad Allaert, M BOTTE, L VAN DEN TORREN, Luc Martens (UGent) and Daniël De Zutter (UGent)

(1996) Proc. of the Technical Conference IPC Prnted Circuits Expo 1996, 3-7 March San Jose, California, pp. S6-l-l->S6-l-10.
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- Conference Paper
- C1
The use of integrated resistors and buried capacitance in high performance telecom printed circuit boards

J PEETERS, E ROOSE, L VANDAM, Ann Ackaert (UGent) , Koenraad Allaert, L VAN DEN TORREN and Luc Martens (UGent)

(1996) 2nd European Conference on Electronic Packaging Technology & 8th International Conference on Interconnection Technology in Electronics, 31 January - 2 February Essen, Germany. p.11-14
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- Conference Paper
- C1
Interconnection technology for advanced high density thick films

M VRANA, André Van Calster (UGent) , R VANDEN BERGHE and Koenraad Allaert

(1995) Proceedings of the 10th European Microelectronics Conference mei. p.190-198

Academic Bibliography

Photovia technology: Some important aspects for reliability

Photovia technology: Some important aspects for reliability.

The realisation of photo-via technology using multiposit as a photo imageable dielectric

Electroless Nickel-Gold Stud Bumping on Laminate for Flip-Chip Assembly

Development of an adhesive TAB joining technology

Interconnection Technology for Advanced High density Thick Films

Radiated emission of PCB tracks.

Characterization of integrated resistors for broadband telecom printed circuit boards

The use of integrated resistors and buried capacitance in high performance telecom printed circuit boards

Interconnection technology for advanced high density thick films

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