Ghent University Academic Bibliography

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Debondable polyurethane-inspired adhesives using malonate-formed amide chemistry

Tim Maiheu (UGent) , Hiba Kassem (UGent) , Adrià Roig Gibert (UGent) , Nicolai Kolb, Alexander Azzawi and Filip Du Prez (UGent)

(2025) EUROPEAN POLYMER JOURNAL. 239.
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- PhD Thesis
On-demand debonding of adhesives through fast dynamic chemistries

Tim Maiheu (UGent)

(2025)
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- Journal Article
- A1
- open access
Polyisoprene-based pressure-sensitive adhesives with dynamic crosslinks

Tim Maiheu (UGent) , Jonas Debuyck (UGent) , Filip Van Lysebetten, Aitor Hernández Toribio (UGent) and Filip Du Prez (UGent)

(2024) EUROPEAN POLYMER JOURNAL. 210.
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- Journal Article
- A1
- open access
Design and continuous (re)processing of thermally resilient poly(styrene-co-maleic maleate)-based covalent adaptable networks

Aitor Hernández Toribio (UGent) , Tim Maiheu (UGent) , Eric Drockenmuller, Damien Montarnal, Johan Winne (UGent) and Filip Du Prez (UGent)

(2024) CHEMISTRY OF MATERIALS. 36(15). p.7487-7503
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- Journal Article
- A1
- open access
Debondable epoxy-acrylate adhesives using β-amino ester chemistry

Tim Maiheu (UGent) , Erica Laguzzi, Andrew T. Slark and Filip Du Prez (UGent)

(2024) ACS APPLIED MATERIALS & INTERFACES. 16(46). p.64050-64057
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- Journal Article
- A1
- open access
Epoxy adhesives with reversible hardeners : controllable thermal debonding in bulk and at interfaces

Filip Van Lysebetten, Tim Maiheu (UGent) , Johan Winne (UGent) and Filip Du Prez (UGent)

(2023) ADVANCED MATERIALS. 35(31).

Academic Bibliography

Debondable polyurethane-inspired adhesives using malonate-formed amide chemistry

On-demand debonding of adhesives through fast dynamic chemistries

Polyisoprene-based pressure-sensitive adhesives with dynamic crosslinks

Design and continuous (re)processing of thermally resilient poly(styrene-co-maleic maleate)-based covalent adaptable networks

Debondable epoxy-acrylate adhesives using β-amino ester chemistry

Epoxy adhesives with reversible hardeners : controllable thermal debonding in bulk and at interfaces

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