Show
Sort by
-
Use of local electrochemical methods (SECM, EC-STM) and AFM to differentiate microstructural effects (EBSD) on very pure copper
-
Study of the influence of the microstructure on the corrosion properties of pure copper
-
- Conference Paper
- P1
- open access
Texture comparison between cold rolled and cryogenically rolled pure copper
-
Texture comparison between room temperature rolled and cryogenically rolled pure copper
-
In situ scanning tunneling microscopy study of grain-dependent corrosion on microcrystalline copper
-
In situ scanning tunneling microscopy study of the intergranular corrosion of copper
-
Structural dependence of gold deposition by nanoplating in polycrystalline copper
-
Scanning electrochemical microscopy to study the effect of crystallographic orientation on the electrochemical activity of pure copper
-
Effect of neighboring grains on the microscopic corrosion behavior of a grain in polycrystalline copper
-
Gold nanoplating as a new method for the quantification of the electrochemical activity of grain boundaries in polycrystalline metals