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- Conference Paper
- C1
- open access
Design of a broadband adiabatic coupler for interfacing PICs to optical redistribution layers
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- Journal Article
- A1
- open access
Expanded-beam backside coupling interface for alignment-tolerant packaging of silicon photonics
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- Conference Paper
- P1
- open access
Through-substrate coupling elements for silicon-photonics-based short-reach optical interconnects
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Aerosol-Jet printed interconnects for 60-Gb/s CMOS driver and microring modulator transmitter assembly
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Integration of ball lens in through-package via to enable photonic chip-to-board coupling