Show 10 5 10 15 20 50 100 250 Sort by year (new to old) Actions Download search results Subscribe to news feed Your filters: cql: author exact 001998443611 cql: author exact 000081425234 Add to list Journal Article A1 Self-aligned flat ultra-thin chip package for flexible circuits Liang Wang (UGent) , Maarten Cauwe (UGent) , Steven Brebels, Walter De Raedt, and Jan Vanfleteren (UGent) (2013) CIRCUIT WORLD. 39(4). p.174-180 Add to list Journal Article A1 Fabrication and characterization of flexible ultrathin chip package using photosensitive polyimide Liang Wang (UGent) , Tom Sterken (UGent) , Maarten Cauwe (UGent) , Dieter Cuypers (UGent) and Jan Vanfleteren (UGent) (2012) IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY. 2(7). p.1099-1106