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The effect of polyether suppressors on the nucleation and growth of copper on RuTa seeded substrate for direct copper plating
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The effect of cupric ion concentration on the nucleation and growth of copper on RuTa seeded substrates
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Nucleation and growth of copper on Ru-based substrates, I : the effect of the inorganic components
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Nucleation and growth of copper on Ru-based substrates, II : the effect of the suppressor additive
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Exploration of process window for fill of sub 30 nm features by direct plating
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Copper plating on resistive substrates, diffusion barrier and alternative seed layers
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Tailoring copper island density for copper plating on a RuTa substrate
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Direct copper plating on a RuTa substrate