Show
Sort by
-
- Journal Article
- A1
- open access
Monolithic integration of microlenses on the backside of a silicon photonics chip for expanded beam coupling
-
- Journal Article
- A1
- open access
Expanded-beam backside coupling interface for alignment-tolerant packaging of silicon photonics
-
- Journal Article
- A1
- open access
Ball lens embedded through-package via to enable backside coupling between silicon photonics interposer and board-level interconnects
-
- Conference Paper
- P1
- open access
Through-substrate coupling elements for silicon-photonics-based short-reach optical interconnects
-
- Journal Article
- A1
- open access
Performance evaluation of backside emitting O-Band grating couplers for 100 μm-thick silicon photonics interposers
-
- Conference Paper
- P1
- open access
Alignment-tolerant interfacing of a photonic integrated circuit using back side etched silicon microlenses
-
Expanded-beam through-substrate coupling interface for alignment tolerant packaging of silicon photonics
-
Integration of ball lens in through-package via to enable photonic chip-to-board coupling
-
Packaging silicon photonics with polymer waveguides for 3D electro-optical integration
-
Laser processing for large area polymer photonic applications