Ghent University Academic Bibliography

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Mechanical and electrical properties of ultra-thin chips and flexible electronics assemblies during bending

Daan van den Ende, H van de Wiel, Roel Kusters, Ashok Sridhar, Jeroen Schram, Maarten Cauwe (UGent) and Jeroen van den Brand

(2014) MICROELECTRONICS RELIABILITY. 54(12). p.2860-2870
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Photonic flash soldering of thin chips and SMD components on foils for flexible electronics

Daan van den Ende, Rob Hendriks, Romain Cauchois, Roel Kusters, Maarten Cauwe (UGent) , Wilhelm Groen and Jeroen van den Brand

(2014) IEEE TRANSACTIONS ON COMPONENTS, PACKAGING AND MANUFACTURING TECHNOLOGY. 4(11). p.1879-1886
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Large area flexible lighting foils using distributed bare LED dies on polyester substrates

Daan van den Ende, Roel Kusters, Maarten Cauwe (UGent) , A van der Waal and Jeroen van den Brand

(2013) MICROELECTRONICS RELIABILITY. 53(12). p.1907-1915
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Integration techniques and applications of thin chips on low cost foil substrates

Daan van den Ende, Ashok Sridhar, Roel Kusters, Jeroen van den Brand, Maarten Cauwe (UGent) and Bjorn Vandecasteele (UGent)

(2013) Smart Systems Integration 2013, Proceedings.
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Reliable filling of through vias with silver based conductive adhesives in flexible PEN substrates using low-cost optimized stencil printing methods

Mária Péter, Daan van den Ende, Bart van Remoortere, Steven Van Put (UGent) , Tomas Podprocky (UGent) , Anja Henckens Henckens and Jeroen van den Brand

(2013) 2013 European Microelectronics Packaging Conference (EMPC).
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High curvature bending characterization of ultra-thin chips and chip-on-foil assemblies

Daan van den Ende, Frits Verhoeven, Pepijn van der Eijnden, Roel Kusters, Ashok Sridhar, Maarten Cauwe (UGent) and Jeroen van den Brand

(2013) 2013 European Microelectronics Packaging Conference (EMPC).
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- Conference Paper
- P1
- open access
Bonding bare die LEDs on PET foils for lighting applications: thermal design modeling and bonding experiments

Daan van den Ende, Roel Kusters, Maarten Cauwe (UGent) , A van der Waal and Jeroen van den Brand

(2012) 2012 4th Electronic system-integration technology conference (ESTC).
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- Conference Paper
- C1
- open access
Flipchip bonding of thin Si dies onto PET foils: possibilities and applications

Jeroen van den Brand, Roel Kusters, Maarten Cauwe (UGent) , Daan van den Ende and Muge Erinc

(2011) Proceedings of the 18th European Microelectronics and Packaging Conference (EMPC 2011). p.425-430

Academic Bibliography

Mechanical and electrical properties of ultra-thin chips and flexible electronics assemblies during bending

Photonic flash soldering of thin chips and SMD components on foils for flexible electronics

Large area flexible lighting foils using distributed bare LED dies on polyester substrates

Integration techniques and applications of thin chips on low cost foil substrates

Reliable filling of through vias with silver based conductive adhesives in flexible PEN substrates using low-cost optimized stencil printing methods

High curvature bending characterization of ultra-thin chips and chip-on-foil assemblies

Bonding bare die LEDs on PET foils for lighting applications: thermal design modeling and bonding experiments

Flipchip bonding of thin Si dies onto PET foils: possibilities and applications

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