Show 10 5 10 15 20 50 100 250 Sort by year (new to old) Actions Download search results Subscribe to news feed Your filters: cql: author="van Remoortere, Bart*" or (type exact bookEditor and editor="van Remoortere, Bart*") Add to list Conference Paper P1 Reliable filling of through vias with silver based conductive adhesives in flexible PEN substrates using low-cost optimized stencil printing methods Mária Péter, Daan van den Ende, Bart van Remoortere, Steven Van Put (UGent) , Tomas Podprocky (UGent) , Anja Henckens Henckens and Jeroen van den Brand (2013) 2013 European Microelectronics Packaging Conference (EMPC).