Show 10 5 10 15 20 50 100 250 Sort by year (new to old) Actions Download search results Subscribe to news feed Your filters: cql: author="Van Kerckhove, Matthias" or (type any "bookEditor issueEditor" and editor="Van Kerckhove,... Add to list Conference Paper C1 Impact of pad finish on mechanical shock resistance of lead-free solder joints tested under shear and in pull mode Bart Vandevelde, Matthias Van Kerckhove, Dominiek Degryse, Wim D'Haese, David Schaubroeck (UGent) , Bart Allaert, Eddy Geerinckx, Ralph Lauwaert and Geert Willems (2013) European Microelectronic Packaging Conference, Proceedings.