Ghent University Academic Bibliography

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- Miscellaneous
Low cost high-density multilayer circuits for MCM-C.

I Born, D Detemmerman, M Vrana, Johan De Baets (UGent) and André Van Calster (UGent)

(1999) MICROELECTRONICS INTERNATIONAL. 16(2). p.55-58
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- Conference Paper
- C1
Low cost high density multilayer interconnection technology

M VRANA, J DEBAETS, André Van Calster (UGent) , I BORN and D DETEMMERMAN

(1998) Proceedings of the 3rd European Conference on Electronic Packaging Technology & 9th International Conference on Interconnection Technology in Electronics (EuPac '98), DVS, juni. p.129-133
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- Conference Paper
- C1
High density thick film multilayers with Ag-based conductors

M VRANA, J DEBAETS, André Van Calster (UGent) , I BORN and D DETEMMERMAN

(1998) Proceedings of the International Symposium on Microelectronics (IMAPS '98), San Diego, november. p.789-794
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- Conference Paper
- P1
A paper-white chip-based display MCM package for portable IT products

Geert Van Doorselaer, B Dobbelaere, M Vrana, X Xie, Nadine Carchon (UGent) , Jean Van Den Steen, Jan Vanfleteren (UGent) , Herbert De Smet (UGent) , Dieter Cuypers (UGent) and André Van Calster (UGent)

(1998) PROCEEDINGS OF THE SOCIETY OF PHOTO-OPTICAL INSTRUMENTATION ENGINEERS (SPIE). 3582. p.543-547
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- Conference Paper
- C1
Flip-chip assembly for chips with gold bumps on high density thick film substrates

M VRANA, Johan De Baets (UGent) , André Van Calster (UGent) and Bart Allaert

(1997) Proceeding of the 11th European Microelectronics Conference, Venice, Italy, mei. p.175-182
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- Miscellaneous
An Anisotropie Adhesive Flip-Chip Technology for LCD Drivers

M Vrana, Johan De Baets (UGent) , André Van Calster (UGent) and Dominique Wojciechowski

(1996) Digest of Technical papers, Vol. 27, SID, San Diego, California, mei pp. 929- 932.
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- Journal Article
- A2
Interconnection Technology for Advanced High density Thick Films

M VRANA, André Van Calster (UGent) , R VANDEN BERGHE and Koenraad Allaert

(1996) Microelectronics International. 13(3). p.5-8
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- Conference Paper
- C1
Flip-chip technology for chip-on-glass applications (LCD)

Dominique Wojciechowski, André Van Calster (UGent) , M VRANA, Johan De Baets (UGent) , M DE CALUWE and P BOSCH

(1996) Proceedings of the European Conference on Electronic Packaging Technology, Vol. 173, Deutscher Verband für Schweisstechnik (DVS), Essen, Germany, januari. p.47-50
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- Journal Article
- A2
Multichannel Optical Modules Compatible with the Fiber-In-Board Technology

G DE PESTEL, A AMBROSY, Q TAN, M VRANA, F MIGOM, H RICHTER, Jan Vandewege (UGent) and Peter Vetter

(1996) IEEE Transactions on Components, Packaging, and Manufacturing Technology, Vol. B-19, No. 1, februari. p.116-123
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- Journal Article
- A1
Multichannel optical modules compatible with the fiber-in-board technology.

G DEPESTEL, A AMBROSY, QS TAN, M VRANA, F MIGOM, H RICHTER, Jan Vandewege (UGent) and P VETTER

(1996) IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY PART B-ADVANCED PACKAGING. 19(1). p.116-123

Academic Bibliography

Low cost high-density multilayer circuits for MCM-C.

Low cost high density multilayer interconnection technology

High density thick film multilayers with Ag-based conductors

A paper-white chip-based display MCM package for portable IT products

Flip-chip assembly for chips with gold bumps on high density thick film substrates

An Anisotropie Adhesive Flip-Chip Technology for LCD Drivers

Interconnection Technology for Advanced High density Thick Films

Flip-chip technology for chip-on-glass applications (LCD)

Multichannel Optical Modules Compatible with the Fiber-In-Board Technology

Multichannel optical modules compatible with the fiber-in-board technology.

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