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- Conference Paper
- C1
- open access
A novel 3D printed focusing probe in scattering-type scanning near-field millimetre & terahertz wave microscope
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- Journal Article
- A1
- open access
Simulation and experimental verification of W-band finite frequency selective surfaces on infinite background with 3D full wave solver NSPWMLFMA
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- Conference Paper
- P1
- open access
Characterization of speckle/despeckling in active millimeter wave imaging systems using a first order 1.5D model - art. no. 619409.
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Inter-chip optical interconnects using imaging fiber bundles and integrated CMOS detectors.
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High-efficiency 650 nm thin-film light-emitting diodes.
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High-efficiency thin-film light-emitting diodes at 650 nm.
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Two dimensional optical interconnect between CMOS IC's
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Two-dimensional optical interconnect between CMOS IC's.
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2-dimensional fiber-based optical interconnect between CMOS IC's
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Technologies for two-dimensional optical interconnect between CMOS IC's