Ghent University Academic Bibliography

Show Sort by

Your filters: cql: author="Torfs, Tom" or (type any "bookEditor journalEditor issueEditor" and editor="Torfs, Tom")

Add to list
Low power wireless sensor network for building monitoring

Tom Torfs, Tom Sterken (UGent) , Steven Brebels, Juan Santana, Richard van den Hoven, Vincent Spiering, Nicolas Bertsch, Davide Trapani and Daniele Zonta

(2013) IEEE SENSORS JOURNAL. 13(3). p.909-915
Add to list
- Conference Paper
- C1
- open access
Low power wireless sensor network for structural health monitoring of buildings using MEMS strain sensors and accelerometers

Tom Torfs, Tom Sterken (UGent) , Steven Brebels, Juan Santana-Corte, Richard Van den Hoven, Nicolas Saillen, Nicolas Bertsch, Davide Trapani and Daniele Zonta

(2012) 2nd MEMSCON workshop : towards intelligent civil infrastructure, Proceedings. p.37-44
Add to list
- Conference Paper
- C1
- open access
High-yield embedding of 30µm thin chips in a flexible PCB using a photopatternable polyimide based ultra-thin chip package (UTCP)

Tom Sterken (UGent) , Maaike Op de Beeck (UGent) , Filip Vermeiren (UGent) , Tom Torfs, Liang Wang (UGent) , Swarnakamal Priyabadini (UGent) , Kristof Dhaenens (UGent) , Dieter Cuypers (UGent) and Jan Vanfleteren (UGent)

(2012) IMAPS 2012 : proceedings of the 45th international symposium on microelectronics. p.940-945
Add to list
Full-scale laboratory validation of a wireless MEMS-based technology for damage assessment of concrete structures

Davide Trapani, Daniele Zonta, Marco Molinari, Angelos Amditis, Matthaios Bimpas, Nicolas Bertsch, Vincent Spiering, Juan Santana, Tom Sterken (UGent) , Tom Torfs, et al.

(2012) PROCEEDINGS OF SPIE, THE INTERNATIONAL SOCIETY FOR OPTICAL ENGINEERING. 8345(1).
Add to list
- Conference Paper
- P1
- open access
Ultra-Thin Chip Package (UTCP) and stretchable circuit technologies for wearable ECG system

Tom Sterken (UGent) , Jan Vanfleteren (UGent) , Tom Torfs, Maaike Op de Beeck, Frederick Bossuyt (UGent) and Chris Van Hoof

(2011) 2011 Annual international conference of the IEEE Engineering in Medicine and Biology Society (EMBS). p.6886-6889
Add to list
- Conference Paper
- C3
A Reliable and comfortable package for wearable medical devices

Tom Sterken (UGent) , Jan Vanfleteren (UGent) , Frederick Bossuyt (UGent) , Steven Brebels, Wim Christiaens (UGent) , Thomas Vervust (UGent) , Michal Jablonski (UGent) , Sheila Dunphy (UGent) , Filip Vermeiren (UGent) , Yung-yu Hsu, et al.

(2011) Microelectronic packaging for medical and Hi-Rel devices, Abstracts.
Add to list
- Conference Paper
- C1
- open access
Low power wireless sensor network for building monitoring

Tom Torfs, Tom Sterken (UGent) , Steven Brebels, Juan Santana-Corte, Richard van den Hoven, Chris Van Hoof, Nicolas Saillen, Nicolas Bertsch, Davide Trapani, Daniele Zonta, et al.

(2011) IEEE Sensors, Papers.
Add to list
- Conference Paper
- C3
3D Integrated, ultra-thin functional microcontroller for wireless, flexible ECG systems

Wim Christiaens (UGent) , Tom Torfs, Wim Huwel, Chris Van Hoof and Jan Vanfleteren (UGent)

(2009) International Semiconductor Technology Conference and China Semiconductor Technology International Conference, Abstracts.
Add to list
- Conference Paper
- P1
- open access
3D Integration of ultra-thin functional devices inside standard multilayer flex laminates

Wim Christiaens (UGent) , Tom Torfs, Wim Huwel, Chris Van Hoof and Jan Vanfleteren (UGent)

(2009) 2009 European Microelectronics and Packaging Conference (EMPC 2009), vols 1 and 2. p.671-675
Add to list
- Conference Paper
- C3
Flexible wireless biopotential system with embedded ultra-thin chip

Tom Torfs, Wim Christiaens (UGent) , Jan Vanfleteren (UGent) , Wim Huwel, Wim Perdu, RF Yazicioglu, Steven Brebels and Chris Van Hoof

(2009) Smart Systems Integration Conference, 3rd, Abstracts.

Academic Bibliography

Low power wireless sensor network for building monitoring

Low power wireless sensor network for structural health monitoring of buildings using MEMS strain sensors and accelerometers

High-yield embedding of 30µm thin chips in a flexible PCB using a photopatternable polyimide based ultra-thin chip package (UTCP)

Full-scale laboratory validation of a wireless MEMS-based technology for damage assessment of concrete structures

Ultra-Thin Chip Package (UTCP) and stretchable circuit technologies for wearable ECG system

A Reliable and comfortable package for wearable medical devices

Low power wireless sensor network for building monitoring

3D Integrated, ultra-thin functional microcontroller for wireless, flexible ECG systems

3D Integration of ultra-thin functional devices inside standard multilayer flex laminates

Flexible wireless biopotential system with embedded ultra-thin chip

Contents

Support

Contact