Ghent University Academic Bibliography

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Your filters: cql: author="Sun, Xiao" or (type any "bookEditor journalEditor issueEditor" and editor="Sun, Xiao")

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Analysis and application of a surface admittance operator for combined magnetic and dielectric contrast in emerging interconnect topologies

Dries Bosman (UGent) , Martijn Huynen (UGent) , Daniël De Zutter (UGent) , Xiao Sun, Nicolas Pantano, Geert van der Plas (UGent) , Eric Beyne and Dries Vande Ginste (UGent)

(2023) IEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUES.
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Interconnect modeling using a surface admittance operator derived with the Fokas method

Dries Bosman (UGent) , Martijn Huynen (UGent) , Daniël De Zutter (UGent) , Xiao Sun, Nicolas Pantano, Geert Van der Plas, Eric Beyne and Dries Vande Ginste (UGent)

(2022) 2022 IEEE 31ST CONFERENCE ON ELECTRICAL PERFORMANCE OF ELECTRONIC PACKAGING AND SYSTEMS (EPEPS 2022). In IEEE Conference on Electrical Performance of Electronic Packaging and Systems-EPEPS
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Entire domain basis function expansion of the differential surface admittance for efficient broadband characterization of lossy interconnects

Martijn Huynen (UGent) , Kamil Yavuz Kapusuz (UGent) , Xiao Sun, Geert Van der Plas, Eric Beyne, Daniël De Zutter (UGent) and Dries Vande Ginste (UGent)

(2020) IEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUES. 68(4). p.1217-1233
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3D heterogeneous package integration of air/magnetic core inductor : 89% efficiency buck converter with backside power delivery network

Xiao Sun, Hesheng Lin, Dimitrios Velenis, John Slabbekoorn, Giacomo Talmelli, Pieter Bex, Tom Sterken (UGent) , Rudy Lauwereins, Christoph Adelmann, Andy Miller, et al.

(2020) 2020 IEEE Symposium on VLSI Technology. In Digest of technical papers (Symposium on VLSI Technology)
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Integrated magnetic cores in FOWLP and their applications

Xiao Sun, John Slabbekoorn, Dimitrios Velenis, Pieter Bex, Fabrice Duval, Tom Sterken (UGent) , Giacomo Talmelli, Inge de Preter, Tomas Webers, Christoph Adelmann, et al.

(2020) 2020 IEEE 70th Electronic Components and Technology Conference (ECTC).
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Packaging and assembly challenges for 50G silicon photonics interposers

Bradley Snyder, Nivesh Mangal, Guy Lepage, Sadhishkumar Balakrishnan, Xiao Sun, Nicolas Pantano, Michal Rakowski, Lieve Bogaerts, Peter De Heyn (UGent) , Peter Verheyen, et al.

(2018) 2018 OPTICAL FIBER COMMUNICATIONS CONFERENCE AND EXPOSITION (OFC).

Academic Bibliography

Analysis and application of a surface admittance operator for combined magnetic and dielectric contrast in emerging interconnect topologies

Interconnect modeling using a surface admittance operator derived with the Fokas method

Entire domain basis function expansion of the differential surface admittance for efficient broadband characterization of lossy interconnects

3D heterogeneous package integration of air/magnetic core inductor : 89% efficiency buck converter with backside power delivery network

Integrated magnetic cores in FOWLP and their applications

Packaging and assembly challenges for 50G silicon photonics interposers

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