Ghent University Academic Bibliography

Journal Article
A1
open access

Broadband electromagnetic modeling of on-chip passives using a differential surface admittance operator for 3-D piecewise homogeneous structures

Tim Pattyn (UGent) , Xiao Sun, Eric Beyne, Daniël De Zutter (UGent) , Martijn Huynen (UGent) and Dries Vande Ginste (UGent)

(2025) IEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUES. 73(12). p.10199-10212

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Conference Paper
C1
open access

Broadband impedance response extraction of on-chip interdigital capacitors using a 3-D DSA operator for piecewise homogeneous structures

Tim Pattyn (UGent) , Xiao Sun, Eric Beyne, Daniël De Zutter (UGent) , Martijn Huynen (UGent) and Dries Vande Ginste (UGent)

(2025) 2025 IEEE 34th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS). p.1-3

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RF Si interposer platform for chiplets based heterogenous systems

Xiao Sun, Siddhartha Sinha, Martijn Huynen (UGent) , Reinier Broucke (UGent) , Melina Lofrano, Vladimir Cherman, Hamideh Jafarpoorchekab, Damien Leech, Angel Uruena, Ehsan Shafahian, et al.

(2025) 2025 IEEE 75TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE, ECTC. In Electronic Components and Technology Conference p.189-196

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Journal Article
A1
open access

Analysis and application of a surface admittance operator for combined magnetic and dielectric contrast in emerging interconnect topologies

Dries Bosman, Martijn Huynen (UGent) , Daniël De Zutter (UGent) , Xiao Sun, Nicolas Pantano, Geert van der Plas, Eric Beyne and Dries Vande Ginste (UGent)

(2023) IEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUES. 71(7). p.2794-2806

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Journal Article
A1
open access

Efficient characterization of interconnects with arbitrary polygonal cross sections using fokas-derived Dirichlet-to-Neumann operators

Dries Bosman, Martijn Huynen (UGent) , Daniël De Zutter (UGent) , Xiao Sun, Nicolas Pantano, Geert van der Plas, Eric Beyne and Dries Vande Ginste (UGent)

(2023) IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY. 13(10). p.1567-1575

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Conference Paper
P1
open access

Interconnect modeling using a surface admittance operator derived with the Fokas method

Dries Bosman, Martijn Huynen (UGent) , Daniël De Zutter (UGent) , Xiao Sun, Nicolas Pantano, Geert Van der Plas, Eric Beyne and Dries Vande Ginste (UGent)

(2022) 2022 IEEE 31ST CONFERENCE ON ELECTRICAL PERFORMANCE OF ELECTRONIC PACKAGING AND SYSTEMS (EPEPS 2022). In IEEE Conference on Electrical Performance of Electronic Packaging and Systems-EPEPS

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Journal Article
A1
open access

Entire domain basis function expansion of the differential surface admittance for efficient broadband characterization of lossy interconnects

Martijn Huynen (UGent) , Kamil Yavuz Kapusuz (UGent) , Xiao Sun, Geert Van der Plas, Eric Beyne, Daniël De Zutter (UGent) and Dries Vande Ginste (UGent)

(2020) IEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUES. 68(4). p.1217-1233

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3D heterogeneous package integration of air/magnetic core inductor : 89% efficiency buck converter with backside power delivery network

Xiao Sun, Hesheng Lin, Dimitrios Velenis, John Slabbekoorn, Giacomo Talmelli, Pieter Bex, Tom Sterken (UGent) , Rudy Lauwereins, Christoph Adelmann, Andy Miller, et al.

(2020) 2020 IEEE SYMPOSIUM ON VLSI TECHNOLOGY. In Symposium on VLSI Technology

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Integrated magnetic cores in FOWLP and their applications

Xiao Sun, John Slabbekoorn, Dimitrios Velenis, Pieter Bex, Fabrice Duval, Tom Sterken (UGent) , Giacomo Talmelli, Inge de Preter, Tomas Webers, Christoph Adelmann, et al.

(2020) 2020 IEEE 70TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC 2020). In Electronic Components and Technology Conference p.1363-1368

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Packaging and assembly challenges for 50G silicon photonics interposers

Bradley Snyder, Nivesh Mangal, Guy Lepage, Sadhishkumar Balakrishnan, Xiao Sun, Nicolas Pantano, Michal Rakowski, Lieve Bogaerts, Peter De Heyn (UGent) , Peter Verheyen, et al.

(2018) 2018 OPTICAL FIBER COMMUNICATIONS CONFERENCE AND EXPOSITION (OFC).

Academic Bibliography

Broadband electromagnetic modeling of on-chip passives using a differential surface admittance operator for 3-D piecewise homogeneous structures

Broadband impedance response extraction of on-chip interdigital capacitors using a 3-D DSA operator for piecewise homogeneous structures

RF Si interposer platform for chiplets based heterogenous systems

Analysis and application of a surface admittance operator for combined magnetic and dielectric contrast in emerging interconnect topologies

Efficient characterization of interconnects with arbitrary polygonal cross sections using fokas-derived Dirichlet-to-Neumann operators

Interconnect modeling using a surface admittance operator derived with the Fokas method

Entire domain basis function expansion of the differential surface admittance for efficient broadband characterization of lossy interconnects

3D heterogeneous package integration of air/magnetic core inductor : 89% efficiency buck converter with backside power delivery network

Integrated magnetic cores in FOWLP and their applications

Packaging and assembly challenges for 50G silicon photonics interposers

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